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題 名 | The Electrodeposition of Molybdenum from Low Temperature Ammonium Formate Molten Salt=低溫型熔融鹽電解鍍鉬之研究 |
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作 者 | 楊肇政; 許信儀; | 書刊名 | 科技學刊 |
卷 期 | 9:3 2000.07[民89.07] |
頁 次 | 頁199-206 |
分類號 | 468.2 |
關鍵詞 | 電解沈積; 熔融鹽電解質; 脈衝電流密度; Electrodeposition; Molten salt electrolytes; Pulse current density; |
語 文 | 英文(English) |
中文摘要 | 電解電鍍之鍍浴溫度介於130℃至150℃範圍,以脈衝及直流技術於熔融蟻酸銨鹽 浴進行鉬金屬電解電鍍。利用SEM、AFM和X射線光譜儀等探討電解鍍鉬層的操作變數和表面 形態間之關係。電解沈積鍍層特性之變數含電流密度、脈衝週期、電解質組成和電極基材等 。綜合研究結果顯示,以週期為百分之七十五之脈衝電流型式當電流密度為25mA╱cm�插A可 獲得高鉬含量且緻密性佳之鉬鍍層。 |
英文摘要 | The electrodeposition of molybdenum from molten ammonium formates has been investigated by direct current and pulse current methods, in the temperature range of 130℃ to 150℃. The relationship between process variables and deposit morphology has been studied. The electrodeposited molybdenum layers were examined by scanning electron microscopy, atomic force microscopy and also analyzed by energy disperse X-ray spectroscopy. The properties of electrodeposited layer were varied with the current density, the current form, pulsed duty cycle, the electrolyte compositions, and the electrode substrates. Compared to conventional direct current electrodeposition, a more compact deposited layer was created by pulsed current technique with pulse current density, i�d=25 mA/cm�徨nd duty cycles of 75%. |
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