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題 名 | 電子元件之三維散熱模式分析=Three-Dimensional Modeling of Heat Dissipation for Electric Components |
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作 者 | 趙隆山; 王世敏; 薛千山; | 書刊名 | 力學 |
卷 期 | 15:2 1999.12[民88.12] |
頁 次 | 頁81-93 |
分類號 | 448.533 |
關鍵詞 | 電子元件; 散熱; 三維模式; 修正強隱法; Electrical components; Heat dissipation; MSIP; |
語 文 | 中文(Chinese) |
中文摘要 | 電子元件的散熱問題,一直都是極待解決的課題,而一般文獻大都只是二維流場模式之電子元件的散熱分析,這與實際上的物理情況有所不同,因此本文所要探討的是三維的的散熱模式,以更接近實際情況的方式來瞭解電子元件於工作時之熱傳情形。本文是以有限差分法與交錯網格來探討三維電子元件之強制對流的熱傳問題, 並以 SIMPLEC 運算法處理 ( 矩形體 ) 渠道中流場之計算,再由能量方程式求解出整個區域的溫度分布,其中離散化後的矩陣方程式是以修正強隱法 (MSIP) 來求解。從數學模式的計算結果,發現雷諾數愈高電子元件的散熱效果愈好,最高的溫度分布區域位於矽晶片中心附近,而在迎風面的上角落處,會有最佳的熱傳區域,而封裝體後側的迴流區會造成能量的累積,但因三維的迴流現象是有進有出的情形,所以其迴流區域並不像二維模式那麼大,能量累積的情形也較不嚴重。其次,基板與封裝體的熱傳導係數比值 (kp /km) 愈大,對封裝體的散熱效果愈好,矽晶片所產生的熱量能較均勻的分布在三維空間中,矽晶片最高溫度也較低,故建議設計基板時採用較大的 kp ╱ km 值,對矽晶片的散熱有較佳的效果。 |
英文摘要 | Proper design of heat dissipation is very importantfor electrical components with high electric power,otherwise the power would damage the circuits. This paper is to study the heat transfer problem of a component in a three-dimensional flow field, which is more practical than a two-dimensional model. In the three-dimensional model, the flow channel is arectangular parallele piped, whose bottom is a printed circuit board (PCB). An electrical component is on the board. The finite difference method is used to investigate the heat transfer problem of the componentin a quasi-steady flow field. The SIMPLEC algorithm is applied to compute the velocity field in the channel. Then, the energy equation is solved to obtain the temperature distribution for the whole domain, including the component, the PCB and the air in the channel. The difference equations are solved by the Modified Strongly Implicit Procedure (MSIP). From the computational result, the case with the larger Reynolds number or thermal conductivity of the PCB has the higher heat dissipation. The highest temperature is in the neighborhood of the chip center and the best area of heat transfer is at the upper corner of the upwind side of the package. The 3-D circulation is open (with flow in and out) but the 2-D one is close so that the 3-D circulation is smaller and has less accumulated energy or better heat dissipation than the 2-D one. |
本系統中英文摘要資訊取自各篇刊載內容。