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題名 | 300mm晶圓光阻液塗佈實驗研究 |
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作者 | 王明文; | 書刊名 | 亞東工業專科學校學報 |
卷期 | 19 1999.06[民88.06] |
頁次 | 頁(5)1-(5)8 |
分類號 | 448.533 |
關鍵詞 | 晶圓; 光阻液塗佈; |
語文 | 中文(Chinese) |
中文摘要 | 目前半導體加工業界多採用旋塗加工法進行光阻液塗佈,此法可略分為兩階段, 第一階段是將晶圓以中高轉速旋轉,藉離心力使液膜產生擴展而達到完全佈滿晶圓表面之目 的,第二階段則以更高轉速旋轉晶圓使液膜均勻薄層化達到1μm左右厚度;但在初始光阻液 佈於晶圓表面的過程中,必然的會產生不穩定手指狀(instability fingers)現象,特別是 在300mm晶圓進行旋塗時更容易殘留,必須另行研發新式技術與製程參數。本研究以光阻液 能完全佈滿晶圓表面,亦即不殘留不穩定手指狀為先決條件,利用各種異形噴嘴或變更製程 參數等方式進行旋塗加工實驗,並針對各種新式塗佈法的優劣進行比較分析,再針對其塗佈 結果進行液膜厚度量測,以比較其膜厚均勻均勻度,以尋找出較佳的旋塗加工方法,提供半 導體加工業界更新製程之參考。 |
英文摘要 | In the IC industry, spin coating is usually used to coat a uniform thin film on the wafer. Liquid used such, as photo-resistant is very expensive. Usually the injector used to spray liquid has a nozzle. The method of spin coating can be separated into two stages. At the first stage, the wafer is rotated in middle speed to generate the centrifugal force acting upon the fluid on the wafer. The fluid film will be developed until cover over the surface of the wafer completely. At second stage, the wafer will be rotated in higher speed that the fluid film will be uniformity by centrifugal force. At the first stage the so-call instability fingers, usually occur especially for bigger size wafer it's disadvantageous to cover over the surface of wafer completely. It is proposed to study how to the effects of various parameters such as quantity of photo-resistant, size and geometry of spread nozzle, spin speed and injection rate affect the film formation during spin coating. In this paper a set of empirical novel spin coating method to achieve uniform coating for 300mm wafer. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。