頁籤選單縮合
題 名 | 半導體產業製程與用電特性之調查分析=Investigation Analysis of Manufacturing Process and Power Consumption Characteristics of Semiconductor Industry |
---|---|
作 者 | 董金蓮; 蘇華宗; 辜振宗; | 書刊名 | 台電工程月刊 |
卷 期 | 599 1998.07[民87.07] |
頁 次 | 頁32-44 |
分類號 | 484.5 |
關鍵詞 | 半導體; 晶圓; IC導線架; IC封裝; Semiconductor; Wafer; IC leadframe IC package; |
語 文 | 中文(Chinese) |
中文摘要 | 半導體產業近年發展迅速,已成為新興之明星產業,我國半導體產業發展至今,產業 體系已具雛形,從設計、製造、封裝、測試,上下游體系完整,並在世界佔有舉足輕重的地位。 半導體業從製程觀點來看,可分晶圓材料、晶圓製造、IC導線架、IC封裝,其中又以晶圓製造 所涉及之技術層次最高,其一舉一動均直接影響其上、下游眾多之相關產業。半導體業用電日 夜差距不大,屬24小時連續運轉生產模式,以空調用電佔比較大約在35%-50%之間,次為製程 用電約在25%~35%之間,製程設備中以使用電熱鍋爐、電鍍設備及變頻控制設備較多;因使用 整流設備及變頻設備極為普遍且數量多,所以其諧波量也大,其中以IC封裝與IC導線架廠產 生諧波量較大,諧波成份則以五次諧波為主。 |
英文摘要 | In recent years, semiconductor industry has been growing rapidly in Taiwan. It has not only gradually become one of Taiwan's most important industries but also plays an important role in the world. In the long run, semiconductor industry has a complete scheme from downstream to upstream, including IC design, manufacturing, packaging and testing. The manufacturing processes of semiconductor industry include wafer material, wafer manufacturing, IC leadframe and IC packaging. Among them wafer manufacturing contains high-tech processes which influence the development of IC related industries. Due to the continuous production processes of semiconductors, daily fluctuation in load is relatively small. The major power consumption is 35%~50% for air conditioning, and 25%~35% for the process equipment. The most common process equipment in semiconductor industry includes heater, plating, and convert controlled equipment. Since rectifier and converter are widely used in semiconductor factories they become the major source of harmonic, especially the fifth harmonic current in IC packaging and IC leadframe factories. |
本系統中英文摘要資訊取自各篇刊載內容。