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題 名 | 聚醯亞胺樹脂在電子相關產業之應用=Applications of Polyimide Resins in Electronic Industry |
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作 者 | 林金雀; | 書刊名 | 化工資訊月刊 |
卷 期 | 13:8 1999.08[民88.08] |
頁 次 | 頁29-34 |
分類號 | 485.34 |
關鍵詞 | 聚醯亞胺樹脂; 電子產業; |
語 文 | 中文(Chinese) |
中文摘要 | 聚醯亞胺樹脂具有相當優異的耐熱特性、耐化學藥品性、機械性質及 電氣性質,因此廣泛應用於航太、電機、機械、汽車、電子等各種產業中。近 年來國內半導體、電子、通訊等相關產業蓬勃發展,帶動國內經濟發展,對於 電子用化學品和材料的需求亦日益提昇,聚醯亞胺樹脂在電子材料上也扮演著 重要角色。聚醯亞胺樹脂在電子相關產業之應用型態以薄膜和塗料為主,主要 應用在IC半導體製造、軟性印刷電路板、液晶顯示器上。 |
英文摘要 | Polyimide resins are high value and high performance polymers with excellent electrical and physical properties in addition to their high thermal stability. In light of this unique combination of desired properties, polymide resins are used in aerospace, electronics, automotive and various other industrial applications. Polyimides have been extensively appled in electronics and optical-electronics industries and have promising growth in several potentia markets. This article describes the polyimide resins demand in Japan and felated applications in semiconductors, FPC and liquid crystal display. |
本系統中英文摘要資訊取自各篇刊載內容。