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題名 | 被動元件整合技術的新發展--高分子厚膜元件的開發趨勢=Advances in Integred Passive Components Technology--Research Trends of Polymer Thick Film Components |
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作者 | 鍾嘉珽; 王新蘅; 蘇德宇; | 書刊名 | 化工資訊月刊 |
卷期 | 13:9 1999.09[民88.09] |
頁次 | 頁39-49 |
分類號 | 448.533 |
關鍵詞 | 被動元件; 高分子厚膜元件; |
語文 | 中文(Chinese) |
中文摘要 | 我國印刷電路板工業始於1969年美國安培公司來台設廠生產,多年 來國內業者雖經多次全球不景氣波及,但迄今展現於前的是締造了總產值/總產 量皆位居全世界第三的紀錄。目前,政府已將電路板工業列為策略性必須輔導 的工業,藉以鞏固我國在全球資訊電子工業之地位。 |
英文摘要 | Although PCB industry is prominent worldwide, creating advanced technologies and higher profits are essential to continued prosperity. More advanced electronic products must be lighter, thinner, shorter and smaller. Several items of components and lCs must be placed in the same volume. the limitations of conventional PTH and SMD components will inhibit the progress of newly emerging technologies. Three new technologies are currently under development:(1)Discrete (2)Ilntegral and (3)This Film on Chip. Integrol passive component is the most promising in this area. In organic substrates, polymer thick films are the most qualified technology to produce passive components. Polymer thick film resistor (PTFR) and polymer thick film capacitor (PTFC) are expected to excel the most in the upcoming century. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。