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題 名 | 高壓水刀加工特性分析與應用研究=A Study of the Characteristics and Applications of High Pressure Water-Jet Cutting |
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作 者 | 周明; | 書刊名 | 技術學刊 |
卷 期 | 14:1 1999.03[民88.03] |
頁 次 | 頁41-48 |
分類號 | 446.893 |
關鍵詞 | 高壓水刀切割; 熱影響區; 骨骼切割; 印刷電路板; Waterjet cutting; Heat-affected zone; Bone cutting; Printed circuit board; |
語 文 | 中文(Chinese) |
中文摘要 | 傳統切割加工容易產生切屑、殘留毛邊、熱影響區、以及熱變形的問題,這些在 在都損害加工之品質;水刀切割之特性為水流可帶走切屑,無切屑殘留問題,不產生熱影響 區,在結合電腦輔助設計╱製造(CAD/CAM)軟體控制下,可發展成為自動化且俱彈性的切 割加工技術,使得水刀在高科技製造業以及醫療中逐漸扮演著重要的角色。 本計劃首先以水刀切割硬材、軟材、厚板、薄板,並且特別針對醫療上堅硬骨骼切割法 及印刷電路板切割技術做深入研究,從實驗數據當中分析水刀之切割特性,藉由實驗探討水 刀切割加工是否能處理傳統切割加工所產生之問題;由實驗結果得知,加砂水刀可解決傳統 手術切割法所產生之骨骼組織燒焦問題;對於印刷電路板切割加工,加砂水箭不但提高水刀 之切割力,而且幾乎無熱影響區出現,更沒有因高熱而產生熱變形所造成板子撓曲的現象。 |
英文摘要 | Traditional cutting processes have some shortcomings which affect the quality of the material which has been cut. These shortcomings include: cutting edge burrs, heat-affected zones, and distortion problems. In waterjet cutting, the debris is carried away by the waterjet, thus producing no residual debris, and no heat-affected zones. Capable of being incorporated into CAD and CAM, waterjet cutting can be developed into an automatic or flexible cutting process. The above characteristics make waterjet cutting important in both high-tech manufacturing and medical surgery. This paper investigates waterjet cutting of hard materials and soft materials, with special attention paid to cutting methods for hard bones in surgical procedures, and cutting methods for printed circuit boards. The cutting behavior of waterjets was analyzed based on experimental data, and the possibility of solving problems of traditional cutting processes through waterjet cutting is discussed. From the test data, it can be seen that waterjets with abrasives are capable of eliminating "burns" in the bone tissues, a defect associated with traditional cutting methods in surgery. For cutting of printed circuit boards, waterjet cutting not only increases cutting capacity, it also avoids any heat-affected zones, or distortions associated with traditional thermal cutting processes. |
本系統中英文摘要資訊取自各篇刊載內容。