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題 名 | Steady State Temperature Prediction of Packaged Devices Using A Transient R-C Mehtod=利用暫態熱阻-熱容方法預測包裝元件之穩態溫度 |
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作 者 | 曾昆福; 張廷桓; 高進興; 羅本喆; 呂維理; 陸續; | 書刊名 | 中正嶺學報 |
卷 期 | 27:2 1999.01[民88.01] |
頁 次 | 頁21-30 |
分類號 | 448.5 |
關鍵詞 | 溫度預測; 穩態溫度量測; 暫態量測技巧; 熱阻-熱容模型; Temperature prediction; Steady state temperature measurement; Transient; Temperature measurement technique; Thermal resistance-heat capacitance model; |
語 文 | 英文(English) |
中文摘要 | 傳統量測包裝元件穩態溫度的方法是相當沒有效率的。本文利用暫態熱阻-熱容 (R-c) 模型,藉由一種新的暫態量測方法作 ansient measurement technique) 來預測包裝 元件之穩態 (Steady state) 溫度。這種方法只要量取幾個暫態的溫度資料,便可以預測出 其穩態溫度。以這種方法所獲得的預測溫度與傳統方法所量測的穩態溫度相比,以熱功率由 1 到 3 瓦,加在這 208 腳四邊出腳 (QFP) 包裝 IC 下, 所得的誤差值最大是六個百分點 。其結果証明這個方法可相當有效率的用於預測包裝元件之穩態溫度預測,而不失去準確性 。 |
英文摘要 | The conventional way to measure the steady state temperature of a packaged device is rather inefficient. In this paper, an R-C circuit model is used to predict the steady state temperature of packaged devices through a discrete transient measurement technique. In this technique, only several transient temperature data are needed for the temperature prediction. After comparing the temperature predicted based on this new methodology with the steady state temperature, a maximum 6 percent of error is obtained for 1 to 3 Watts of power applied on a 208 pins QFP (Quad Flat Package). Therefore, it is concluded that this new methodology can be emp.loyed to predict the steady state temperature of a packaged device more efficiently without losing accuracy. |
本系統中英文摘要資訊取自各篇刊載內容。