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題 名 | 退火處理對鋁質電解電容器用鋁箔電蝕行為之影響=The Effect of Annealing Treatment on the Dc-Etching Behavior of Aluminum Foil for Electrolytic Capacitor Usage |
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作 者 | 林文; 涂肇嘉; 林清封; 彭裕民; | 書刊名 | 材料科學 |
卷 期 | 29:1 1997.03[民86.03] |
頁 次 | 頁23-29 |
分類號 | 440.35 |
關鍵詞 | 退火; 鋁箔; 電蝕; 立方度; 電容量; Anneal; Aluminum foil; DC-etching; Cubicity; Capacitance; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究在探討退火處理對於電容器用鋁箔之性質及其電蝕行為之影響。結果顯示 ,隨退火溫度之提升,將造成鋁箔晶粒成長,差排密度下降且表面差排坑有向晶界聚集之現 象。對高純度鋁箔而言,熱處理會造成立方度的提高,較高的退火溫度有較高的立方度;立 方度的提升使鋁箔電容量提高。 在 350 ℃加熱一小時之鋁箔有最大電容量。 450 ℃,550 ℃退火之鋁箔,雖立方度提高但因差排密度下降造成電容量下降。低純度鋁箔,立方度因熱 處理而下降,同時因雜質高造成嚴重表面蝕刻。 |
英文摘要 | The effects of various annealing temperature on the properties of high purity aluminum foils for electrolytic capacitor application and the DC-etching behavior of the annealed foils were investigated in this work. The grain size increase and dislocation density decrease as the anneal temperature increase. The dislocation pits segregate in the grain boundary through heat treatment. For high purity aluminum foil, the higher temperature of anneal, the higher cubicity is formed. The high cubicity results in higher capacitance of etched Al foil. There is maxium capacity in foils which treated at 350 ℃. Although the cubicity are higher for the 450, 550 ℃ treated foils, their capacitances are smaller due to the dislocation density decrease. For foils with lower purity (<99.95), the cubicity is decrease throuth annealing, and the surface etching is serious resulted from concentraction of impurity elements in the foils. |
本系統中英文摘要資訊取自各篇刊載內容。