查詢結果分析
來源資料
相關文獻
- 氯化銅蝕刻液之研究
- 界面活性劑在再生紙漿工程上之脫墨漂白作用
- 影印廢紙之脫墨再生
- 鹼性清洗劑
- 黑鯛第一型類胰島素生長因子之融合蛋白質溶解性的研究
- Localized Ridge Preservation Using Guided Bone Regeneration
- 牙科種植體治療之嵴上牙嵴增進術
- 以引導組織再生術治療伴隨有牙根表面牙結石狀沉著物的齒根尖周圍病灶--病例報告
- Flow Cytometric Measurement of Proliferation Rate in Human Hyperplastic Serum Psa Level, Cellular Component, Prostate Volume and Regrowth Rate
- 水稻臺農67號胚癒合組織之誘導及再生力研究
頁籤選單縮合
題 名 | 氯化銅蝕刻液之研究 |
---|---|
作 者 | 張良濤; | 書刊名 | 技術學刊 |
卷 期 | 9:3 1994.09[民83.09] |
頁 次 | 頁291-297 |
分類號 | 468 |
關鍵詞 | 氯化銅蝕刻液; 再生; 界面活性劑; Cupric chloride etching solution; Regeneration; Surface active agent; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究為探討蝕刻銅液中之氯化銅蝕刻液,以過氧化氫、鹽酸及氯化鈉,做再生操作;利用色差計,紫外光及可見光光譜儀及氧化還原電位計,做再生指標。結果發現以紫外光及可見光光譜儀之瀏定,可達到迅速準確的效果。本研究選用polyoxyethylenelauryl amine非離子性界面活性劑之添加量探討,結果發現加入適當之量 (3~5mg/L),對蝕刻效果,有很大的幫助,且對細線路之蝕刻,效果甚佳,故對電路板之蝕刻,可選擇無添加劑與有添加劑兩者依序操作,能達到最佳的效果。 |
英文摘要 | Cupric chloride etching solution of the copper etching in the P.C. board manufacture was surveyed for its regeneration through hydrogen peroxide (H2O2), hydrochloric acid(HCℓ) and sodium chloride (NaCl); and for its regeneration index by color and color difference meter, U.V. spectrophotometer and oxidation-reduction potential meter. Rapid and accurate results are achieved when U. V. spectrophotometer is utilized. The non-ionic surface active agent, polyoxyethylene lauryl amine, is selected as an additive and test data of the appropriate addition amount of 3-5 mg/L reveal that an enormous effect on the etching practice, especially for the fineline production. The multiprocessing of the circuit board etching without and then with additives yields the best results. |
本系統中英文摘要資訊取自各篇刊載內容。