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題 名 | 鉬/銅之製程及其顯微組織與物理性質之關係=P/M Processes for Making Mo-Cu Composites and the Effect of the Resulting Microstructure on the Physical Properties |
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作 者 | 黃坤祥; 吳嘉信; 鄭榮和; 黃承照; | 書刊名 | 粉末冶金會刊 |
卷 期 | 25:3 2000.08[民89.08] |
頁 次 | 頁159-165 |
分類號 | 440.34 |
關鍵詞 | 電接觸點; 散熱體; 鉬-銅; 熱膨脹係數; 熔滲; 電阻; 電腦模擬; Resistivity; Thermal expansion coefficient; Mo-Cu; Composite; Heat sinks; |
語 文 | 中文(Chinese) |
中文摘要 | 散熱體及電接點等材料需要低熱膨脹係數、高耐磨耗性、高耐電弧性並且高導電性,而鎢、銅、鎢、銀、鉬、銀、鉬-銅等即為符合此類需求的材料。一般而言,這些性質應與成品之顯微組織有關,但至今均尚未見相關之研究報導。本研究的目的在於以鉬-銅作為實驗材料,選擇四種不同之製程(1)鉬粉燒結後滲銅,(2)如同(1)法但採用鍍銅鉬粉,(3)將鉬生胚直接滲銅,(4)如同(3)法,但採用鍍銅鉬粉。使這此胚體具有不同之顯微組織,這些組織之差異性與胚體物理性質(如電阻、熱膨脹係數)之關係將在本文中作一討論。 |
英文摘要 | Mo/Cu composite materials are frequently used as heat sinks and electrical contacts. They usually require the following properties: high thermal and electrical conductivity, good erosion and and acring resistance, and reasonable mechanical strength at high temperatures. The challenges are to make Mo or W skeletons without forming isolated pores and then make compacts with uniformly distributed Cu. It is generally believed that the physical properties are related to the microstructure. However, little literature has been reported to date. This study uses four different processes to make compacts with different microstructures. The thermal expansion coefficient and resistivity were measured. Computer modeling was also established and compared to these properties. |
本系統中英文摘要資訊取自各篇刊載內容。