查詢結果分析
來源資料
頁籤選單縮合
| 題 名 | A Study on the Electroless Copper Plating Baths for the Printed Circuit Board=印刷電路板化學鍍銅鍍液之研究 |
|---|---|
| 作 者 | 張新福; 黃銘川; | 書刊名 | 逢甲學報 |
| 卷 期 | 23 1990.11[民79.11] |
| 頁 次 | 頁367-384 |
| 分類號 | 472.16 |
| 關鍵詞 | 化學; 印刷; 電路板; 鍍液; 鍍銅; |
| 語 文 | 英文(English) |
| 中文摘要 | 針對印刷電路板全加成程序的化學銅鍍液做系統之研究,分析影響析鍍速率及鍍層銅膜品質參數,如(I)化學銅鍍液組成,(II)安定劑的種類及濃度及(III)操作條件。鍍層銅膜的機械性質由張力試驗機量測,其表面形態由電子顯鏡(SEM)加以分析,以尋求化學銅析鍍之最佳操作條件。 化學銅鍍液由氧化銅(CuO)、錯化劑(EDTA)、還原劑(HCHO)、pH調節劑(NaOH)、界面活劑(PEG1000)及安定劑如[]啶(Pyrdine)、[]啶(2'2-bipyridine)及1,10-二氧雜菲(1'10-phenanthroline)等所組成,其最佳組成和操作條件如下(1升溶液): 氧化銅(CuO): 0.03M 安定劑(如下):5ppm 乙二胺二醋酸鈉(EDTA.2NA): 0.06M (I)[]啶 甲醛(HCHO): 0.045M (II)2,2'-二[]啶 界面活性濟(PEG1000): 5ppm (III)1,10-二氮雜非 溫度:70℃ 鍍液體積╱鍍件表面積(V/A):5 空氣流速:4l/hr 化學銅鍍層厚度為21∼26μm,析鍍速率為3.2∼3.5μm/hr,延伸率為6∼8%,張力強度為35∼42kg/mm[]。 實驗結果顯示微量的安定劑對化學銅鍍層的表面結構和延伸率有很大的影響。 |
| 英文摘要 | A systematic study on the electroless copper plating baths was conducted in this research for the fully additive process of the printed circuit board. Analysis was performed for the variables of plating rate and quality of deposits, such as (I) formulations of electroless copper plating baths, (II) concentration and kinds of the stabilizing agent and (III) optimal operating conditions. As reported previously the mechanical properties were measured by tensile tests and the scanning electron microscopy was carried out to study the surface morphology, for the purpose of finding and optimal condition. An electroless coppor bath was formulated by using a mixture of CuO, complexing agent (EDTA), reducing agent(HCHO), pH-adjusting agent (NaOH) surfactant (PEG1000) and various stablizing agent such as pyridine, 2'2-bipyridine and 1,10--phenanthroline. The optimal operating conditions and baths compositions are as follows:(for one liter solution) Copper oxide (CuO): 0.03M stablizing agent.(listed below): 5ppm EDTA.2Na: 0.06M (I)Pyridine Formalin (HCHO): 0.045M (II)2,2'-bipyridine surfactant (PEG1000): 5ppm (III)1,10-phenanthroline. Temperature: 70℃ (V/A): 5 Air rate: 4l/hr The thickness the copper film was 21∼26μm; and was plated at an average rate 3.2∼3.5μm/hr. The plating film has 6-8% elongation and a tensile strength of 35-42kg/mm[] The experimental results showed that the trace amount of stablizing agent has profound influence on both the surface morphology and ductility of the elec-tro-less copper. |
本系統中英文摘要資訊取自各篇刊載內容。