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| 題 名 | 低成本且具量產性之Mini-LED轉移技術=A Cost-Effective and Scalable Mini-LED Transfer Technology for Mass Production |
|---|---|
| 作 者 | 成柏翰; 方崇仰; 彭意興; 曾景泰; 臧志仁; 池茗權; | 書刊名 | 國立虎尾科技大學學報 |
| 卷 期 | 40:1 2026.03[民115.03] |
| 頁 次 | 頁49-61 |
| 分類號 | 448.652 |
| 關鍵詞 | 巨量轉移; 雷射功率; Mini-LED; Mass transfer; Laser power; |
| 語 文 | 中文(Chinese) |
| DOI | 10.6425/JNHUST.202603_40(1).0003 |
| 中文摘要 | 本研究報告了我們在應用於虛擬實境(VR)顯示器的Mini-LED背板製作過程中,於Mini-LED晶片轉移技術方面的最新發展。此技術為Mini-LED背光顯示器製程中的關鍵環節。透過採用具保護蓋板的Mini-LED晶片,有效解決了晶片在轉移過程中易破裂的問題,並將雷射轉移次數由三次減少為兩次。在第一次雷射轉移製程中,針對臨時基板與藍膜之間的間距設定及雷射剝離功率進行優化;在第二次轉移製程中,導入對位壓合技術以降低晶片移位的風險。最終,我們成功將2,500顆Mini-LED晶片的轉移良率提升至99.9%。此技術的發展對於推動高良率巨量轉移製程,並實現低成本且具量產潛力的商用化Mini-LEDVR顯示器,具有重要意義。此外,針對VR顯示器對低功耗的需求,本研究亦提出透過調整光學膜堆疊結構以收斂背光模組光型,進而提升Mini-LED背光模組整體光學效率的方法。 |
| 英文摘要 | This paper reports our recent advancements in Mini-LED chip transfer technology for the fabrication of Mini-LED backplanes used in virtual reality (VR) displays, a key process in Mini-LED backlight display manufacturing. By employing Mini-LED chips with protective cover glass, the issue of chip breakage during transfer was effectively mitigated, and the number of laser transfer steps was reduced from three to two. In the first laser transfer process, the spacing between the temporary substrate and blue tape, as well as the laser detachment power, were optimized. In the second transfer process, an alignment and bonding procedure was introduced to minimize the risk of chip displacement. As a result, a transfer yield of 99.9% was achieved for 2,500 Mini-LED chips. This technological advancement significantly contributes to the realization of high-yield, large-scale transfer processes and the development of cost-effective, mass-producible Mini-LED VR displays. Furthermore, addressing the low-power requirements of VR systems, this study also proposes an approach to enhance the optical efficiency of the Mini-LED backlight module by optimizing the optical film stack to achieve a more convergent light distribution. |
本系統中英文摘要資訊取自各篇刊載內容。