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| 題 名 | 原子級半導體製程整合in-situ檢測設備技術=The in-situ Measuring Technologies Applied on Atomic Layer Deposition |
|---|---|
| 作 者 | 陳建維; 張展源; | 書刊名 | 科儀新知 |
| 卷 期 | 242 2025.03[民114.03] |
| 頁 次 | 頁64-73 |
| 專 輯 | 「半導體製程檢測設備與in-situ技術」專題 |
| 分類號 | 448.68 |
| 關鍵詞 | X射線光電子能譜儀; 原子級半導體; |
| 語 文 | 中文(Chinese) |
| 中文摘要 | 本技術將X射線光電子能譜儀(X-ray photoelectron spectrometer, XPS)結合原子層沉積系統(atomic layer deposition, ALD)、原子層蝕刻系統(atomic layer etching, ALE)和快速高溫退火系統(rapid thermal processing, RTP)等先進製程模組,並搭配自主開發的晶圓傳輸系統,使樣品可於各模組間進行真空傳輸。除了具備設備自動化的優勢外,最主要目的是要最大程度避免晶片在送至分析腔體的傳送過程中與大氣接觸,利用高真空的條件排除外在環境對晶片表面可能產生的物理、化學或是其它汙染等影響,進而取得最接近樣品原始狀態的真實數據。我們在此平台上已驗證了低含氧ALD薄膜製程的開發,這是過往單機型的ALD設備在沉積此類對水氧高敏感的薄膜製程時難以突破的瓶頸。除此之外,包含薄膜的硫化、氟化、退火乃至電漿還原等製程也藉由與近臨場成分分析技術的搭配,得到高可靠度的化學能譜變化或是成分分析結果,而透過本技術與傳統非臨場分析方法的對照,在多項數據都呈現出此分析方法確實能克服部份環境的影響與干擾。 |
| 英文摘要 | This technology integrates an X-ray photoelectron spectrometer (XPS) with advanced process modules namely an atomic layer deposition (ALD) system, an atomic layer etching (ALE) system, and a rapid thermal processing (RTP) system and incorporates a self-developed wafer transfer system that enables vacuum transfer of chips between each module. In addition to the advantages of equipment automation, the primary objective is to minimize the chip's exposure to the atmosphere while it is being transferred to the analysis chamber. By maintaining high-vacuum conditions, potential physical, chemical, or other forms of contamination from the external environment are eliminated, thereby obtaining data that closely represents the sample's original state. Using this platform, we have successfully validated the development of low-oxygen ALD thin-film processes -an achievement that addresses the longstanding challenges faced by standalone ALD tools in depositing highly water- and oxygen-sensitive films. Moreover, processes such as film sulfidation, fluorination, annealing, and even plasma reduction can be precisely monitored in near-real time, yielding highly reliable chemical spectroscopic and compositional analysis results. Comparisons with conventional ex-situ methods consistently demonstrate that this approach can indeed overcome certain environmental influences and interferences, providing more accurate and representative data. |
本系統中英文摘要資訊取自各篇刊載內容。