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題名 | 氣體反壓對ABS高分子複合材料導電品質之研究=Study on the Conductivity Qualities for Abs Polymer Composites Using Gas Counter Pressure |
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作者 | 李平惠; 林明俊; Lee, P. H.; Lin, M. J.; |
期刊 | 南亞學報 |
出版日期 | 20161200 |
卷期 | 36 2016.12[民105.12] |
頁次 | 頁30-43 |
分類號 | 440.2 |
語文 | chi |
關鍵詞 | 氣體反壓; 碳纖維; 穿透導電度; Gas counter pressure; Carbon fiber; Through-plane electrical conductivity; |
中文摘要 | 熱塑性複合材料大量應用於綠色能源、汽車輕量化與3C等產業,複合材料之導電性要求較過去更高,提升導電性可將碳纖維含量增加,但易造成熔膠黏度變高和成本增加,且導電性與碳纖維含量多寡與碳纖維配向分佈息息相關。本研究使用氣體反壓法(Gas Counter Pressure, GCP)應用於射出成型製程,在不同成型參數、持壓時間對纖維含量15wt%CF的ABS複合材料之成型實驗,探討料溫、射速、壓力與持壓時間對各個位置之穿透導電度(Through-Plane Electrical Conductivity , TPEC)之影響。 研究結果顯示,穿透導電度隨射出速度增加而降低,各個位置高低順序為遠澆大於中間大於近澆位置,較佳射速為10 cm3/s;氣體反壓下及料溫溫度提高,其穿透導電度隨料溫增加而改善,並在持壓時間下與料溫250℃,穿透導電度有所提升;氣體反壓下和較佳成型參數,各個位置之穿透導電度皆有所改善,於反壓壓力100 bar下,比較有/無持壓時間之穿透導電度分別為3.31S/cm與3.21S/cm,其改善率分別為7.6%和6%。 |
英文摘要 | Polymers filled with conducting fibers to provide electrical conductivity performance have received great attention due to the requirements of many engineering applications. In the present article, injection molding of ABS/carbon-fiber composites using applied Gas Counter Pressure (GCP) was conducted and the overall fiber orientation and associated through-plane electrical conductivity (TPEC) and various locations (far gate, center, and near gate) were characterized. Results show that under fixed counter pressure and increasing flowing rate, TPC decreased in far, center and near position, and 10 cm3/s was observed as the optimum flowing rate. Under fixed counter pressure and increasing meting temperature, TPEC improved with higher melting temperature and holding time. With optimum molding parameters and counter pressure, TPEC improved. For instance, at 100 bar TPEC was 3.31 S/cm with holding time, and 3.21 S/cm without holding time, respectively increased to 7.6 % and 6 % as compared to traditional injection molding out of counter pressure. The results obtained in this investigation reveal the potential application of GCP technology associated with mold temperature control in injection molding to manufacture products with enhanced electrical conductivity in the future. |
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