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題名 | 動態及等溫DSC熱掃描應用於環氧樹脂/酚液化柳杉摻合樹脂之硬化性分析=Application of Dynamic and Isothermal DSC Heat Scanning to the Analysis of the Curing Bevavior of Blended Resins Prepared by Epoxy Resin/Phenol-Liquefied Cryptomeria Japonica |
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作者姓名(中文) | 李文昭; 康甄玲; 吳政穎; 陳奕君; | 書刊名 | 中華林學季刊 |
卷期 | 49:2 2016.06[民105.06] |
頁次 | 頁165-176 |
分類號 | 474.1 |
關鍵詞 | 摻合樹脂; 柳杉; 熱示差掃描卡量; 環氧樹脂; 酚液化木材; Blended resins; Cryptomeria japonica; Differential scanning calorimetry; Epoxy resins; Phenol-liquefied wood; |
語文 | 中文(Chinese) |
中文摘要 | 本研究將柳杉(Cryptomeria japonica, Japanese cedar)木粉以酚為溶劑,HCl及H_2SO_4為催化劑進行液化處理得液化柳杉LW-C及LW-S,兩種液化柳杉與環氧樹脂以重量比50/100混合調配摻合環氧樹脂,以樹脂重10%之三乙基四胺為硬化劑,並利用熱示差掃描卡量儀(Differential scanning calorimetry;DSC)以動態(30~200℃)及等溫(55℃、65℃、75℃)熱掃描模式分析環氧樹脂及摻合樹脂之硬化反應行為。由動態DSC分析結果顯示Epoxy、Epoxy/LW-C及 Epoxy/LW-S三種樹脂在熱掃描過程均出現架橋反應之放熱峰,硬化反應熱分別為250.6 J/g、186.5 J/g及82.4 J/g,其硬化反應符合Arrhenius動力學模式,三種樹脂之活化能分別為63.9 kJ/mol、53.8 kJ/mol及78.1 kJ/mol。等溫DSC熱硬化性分析結果顯示三種樹脂之放熱峰出現在熱掃描初期,設定溫度愈高者,放熱峰強度愈大,反應終止時間愈短,其硬化反應亦符合Arrhenius動力學模式,然其活化能低於動態熱掃描分析所得者,三種環氧樹脂比較,其中Epoxy/LW-S之反應性受溫度之影響最為明顯。 |
英文摘要 | Liquefied woods, named LW-C and LW-S, were obtained by liquefying wood powders of Cryptomeria japonica (Japanese cedar) in phenol with HCl and H_2SO_4 as the catalyst, respectively. The blended epoxy resins were prepared by mixing epoxy resin with liquefied C. japonica wood with the weight ratio of 100/50. Ten percent of triethylenetetramine based on the weight of resin was added as a hardener. The curing behavior of epoxy resin and blended resins (Epoxy/LW-C and Epoxy/LW-S) were detected by differential scanning calorimetry (DSC) with dynamic (30~200℃) and isothermal (55℃, 65℃ and 75℃) heat scanning mode. The dynamic DSC analysis showed that an exothermic peak caused by crosslinking reaction appeared at the period of heat scanning with the curing reaction heat of 250.6 J/g, 186.5 J/g and 82.4 J/ g for Epoxy, Epoxy/LW-C and Epoxy/LW-S, respectively. Their curing reactions could fit the Arrhenius kinetic equation, which had the activation energy of 63.9 kJ/mol, 53.8 kJ/mol and 78.1 kJ/mol for Epoxy, Epoxy/LW-C and Epoxy/LW-S, respectively. The isothermal DSC analysis showed that the exothermic peak of these three resins appeared at the initial stage of thermal scanning. Increasing the scanning temperature, the intensity of the exothermic peak strengthened, but the reaction terminated time shortened. Their curing reactions could also fit the Arrhenius kinetic equation. However, their reactivity energy was lower than that obtained from the dynamic DSC analysis. Comparison of the three kinds of epoxy resin, the effect of temperature on the reactivity was the most notable for Epoxy/LW-S than the others. |
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