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題 名 | 超短脈衝雷射應用於微通孔成形之探討=Applying Femtosecond Laser to Fabricate Micro-via |
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作 者 | 王智; 姜智豪; 王玉平; | 書刊名 | 新新科技年刊 |
卷 期 | 12 2016.01[民105.01] |
頁 次 | 頁25-31 |
分類號 | 336.9 |
關鍵詞 | 超短脈衝; 飛秒雷射; 微通孔; 雷射鑽孔; Extreme-short-pulsed; Femtosecond laser; Micro-via; Laser drilling; |
語 文 | 中文(Chinese) |
中文摘要 | 氮化鋁具備優異的熱傳導和低漏電特性,使其成為良好的中介層基材選項。由於氮化鋁在氯系電漿的乾蝕刻效率不佳,如何在氮化鋁的材料上製備高深寬比的微通孔,是一個十分關鍵製程。飛秒雷射(Femtosecond Laser)具備飛秒尺度的超短脈衝(fs, 10-15 s),可以在極少熱累積的情況下,對目標物進行精確的微米尺度加工,有效率地製備氮化鋁微通孔。在此研究中,我們利用超短脈衝雷射鑽孔技術,突破傳統長脈衝(>10-6 s)之極限,完成孔徑小於10μm的氮化鋁微通孔,其錐度僅0.33%且深寬比高達23。 |
英文摘要 | AlN (Aluminum Nitride) with unique properties such as superior thermal conductivity and low leakage current property, which leads it a desire material for interposer. However, the through AlN vias (TAV) formation methods have to be developed due to its low etching rate using Cl based plasma etching. Femtosecond laser pulses with pulse duration of several tens femtosecond (fs, 10-15 s) provide precisely matching patterns with extremely low thermal budget, which can effectively fabricate tiny vias in AlN interposer. In this study, a femtosecond laser was used to drill TAVs. TAVs with diameters of less than 10 micrometer, a taper ratio of 0.33% and aspect ratio of approximately 23 were produced. |
本系統中英文摘要資訊取自各篇刊載內容。