頁籤選單縮合
題名 | 不同酚原料Novolak型PF樹脂製作成型板之性質=Properties of Molding Plates Made with Novolak-type Phenol-formaldehyde Resins from Various Phenol Resources |
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作者 | 謝漢民; 李文昭; | 書刊名 | 林產工業 |
卷期 | 32:4 2013.12[民102.12] |
頁次 | 頁237-246 |
分類號 | 436.51 |
關鍵詞 | 柳杉; 液化木材; 成型板; Novolak型酚醛樹脂; Cryptomeria japonica; Liquefied wood; Molding plates; Novolak-type phenol-formaldehyde resins; |
語文 | 中文(Chinese) |
中文摘要 | 本研究將柳杉木材以酚為溶劑,並分別以鹽酸(HCl)及硫酸(H_2SO_4)為催化劑進行液化處理,所得為C-LW及S-LW兩種液化柳杉。其中S-LW之殘渣率較低,結合酚含量較高,但黏度及平均分子量較大。將酚、C-LW及S-LW分別與福馬林於甲醛/酚莫耳比0.85/1條件下合成PF、C-PF及S-PF三種Novolak型PF樹脂,其中PF樹脂之分子量為多分散單峰分佈型態,C-PF及S-PF樹脂則含部分較高分子量成分。DSC分析顯示,C-PF樹脂及S-PF樹脂在較低溫即發生架橋反應,然其反應之溫度範圍較寬,放熱量較小。進一步則將樹脂粉與木粉、六亞甲基四胺、硬脂酸鋅混合,並以熱壓製作成型板,結果顯示三種樹脂成型板均有良好的尺寸安定性,其中以PF樹脂有較佳之物理、機械性質,C-PF樹脂及S-PF樹脂成型板之差異不大。DMA及TGA顯示PF樹脂成型板有較大剛性及較佳熱抵抗性,C-PF樹脂成型板次之。 |
英文摘要 | Wood of Japanese cedar (Cryptomeria japonica D. Don) was liquefied in phenol with HCl and H_2SO_4 as the catalyst to obtain the liquefied Japanese cedar of C-LW and S-LW. S-LW had lower residue content and higher combined phenol but higher viscosity and average molecular weight than that of C-LW. Three kinds of novolak-type phenol-formaldehyde (PF) resins, named PF, C-PF and S-PF, were synthesized by reacting phenol, C-LW and S-LW with formalin with the formaldehyde/phenol molar ratio of 0.85/1, respectively. The molecular weight distribution of PF resin showed a single peak with polydispersity. However, some of the high molecular weight resins appeared in C-PF resin and S-PF resin. DSC analysis showed C-PF resin and S-PF resin underwent the crosslinking reaction at lower temperature, but which had a broader reaction temperature range and had less exothermic heat than that of PF resin. Molding plates were made by mixing resin flour, wood powder, hexamine and zinc stearate and set under hot-pressing. The results showed that all molding plates had good dimensional stability. Among which, using PF resin as the binder had better physical and mechanical properties. But it had no significant difference between the plates made with C-PF resin and S-PF resin. DMA and TGA results showed molding plate made with PF resin had higher stiffness and better heat resistance, followed by that with C-PF resin. |
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