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題 名 | Contactless Testing for Pre-bond Interposers with Package-aware Thermal Simulations=具有封裝感知熱模擬之非接觸式中介層測試 |
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作 者 | Chien, Jui-hung; Lin, Hsueh-ju; Lung, Chiao-ling; Hsu, Ruei-siang; Yeh, Ka-yi; Chang, Shih-chieh; | 書刊名 | 電腦與通訊 |
卷 期 | 157 2014.06[民103.06] |
頁 次 | 頁53-60 |
專 輯 | 異質多核心技術專題 |
分類號 | 448.57 |
關鍵詞 | 三維積體電路; 測試; 熱分析; 3D-IC; Interposer; Testing; Thermal analysis; |
語 文 | 英文(English) |
英文摘要 | In this paper, we study the testing flow in fabrication process of stacked-die products. We discuss the difficulties of traditional testing mechanism. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed in this paper. We propose a testing framework comprising a heating laser and an infrared-radiation camera. In addition, we also build a completely correct model of a functional interposer. By our proposed Classification Algorithm and BDA classifier, functional and defective interposers can be differentiated. Our experimental results show that the proposed framework provides an over 97% accuracy to identify functional interposers from a whole batch of untested products. |
本系統中英文摘要資訊取自各篇刊載內容。