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題 名 | 智慧型手機散熱設計=Thermal Design of a Smart Phone |
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作 者 | 陳品志; | 書刊名 | 東方學報 |
卷 期 | 35 2014.12[民103.12] |
頁 次 | 頁41-53 |
分類號 | 448.5 |
關鍵詞 | 消費性電子產品; 超薄式熱管; 毛細結構; 傳熱能力; 3C product; Ultra slim heat pipe; Structure of capillary; Heat transfer capacity; |
語 文 | 中文(Chinese) |
中文摘要 | 消費性電子產品已朝向高發熱密度與高性能品質發展,本論文主要設計尺寸小於1毫米超薄式熱管來冷卻智慧型手機。設計上採用2種毛細結構組成,實驗結果顯示厚度1毫米超薄式熱管可以散熱約23瓦,0.7毫米超薄熱管散熱約8瓦。也證明厚度0.7毫米~1.0毫米的超薄式熱管具有優越的傳熱能力,因此超薄式熱管散熱模組可能成為下一代產品散熱選擇。 |
英文摘要 | The trend of 3C product is towards high power density and high performance quality. The purpose of this paper is to design an ultra slim heat pipe( which dimension is less 1mm)for cooling a smart phone . Two kinds of structure of capillary are also developed. The experimental results shown the 1mm thickness could dissipate heat 23W and the 0.7mm thickness could dissipate heat 8W. The ultra slim heat pipe of thickness between 0.7mm and 1.0mm has a high heat transfer capacity. Otherwise, the ultra slim heat sink may be becoming a candidate cooler of smart phone in the next generation. |
本系統中英文摘要資訊取自各篇刊載內容。