頁籤選單縮合
題 名 | 半導體晶圓測試碳足跡評估及分析=Carbon Footprint Assessment and Analysis of Semiconductor Wafer Probing |
---|---|
作 者 | 呂博裕; 曾華煜; 陳欽雨; | 書刊名 | 先進工程學刊 |
卷 期 | 10:1 2015.01[民104.01] |
頁 次 | 頁1-7 |
分類號 | 445.9 |
關鍵詞 | 半導體; 晶圓測試; 碳足跡; 溫室氣體; Semiconductor; Wafer probing; Carbon footprint; Greenhouse gases; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究之研究架構是依據ISO/TS 14067標準與環保署所編指引,探討晶圓測試進行碳足跡評估之必要原則與方法,並獲致碳足跡評估結果。本研究挑選一家實際的專業晶圓測試廠為個案,並選擇測試量占最多數的晶圓型號進行晶圓測試碳足跡分析,產品功能單位為一批25片晶圓。研究結果顯示晶圓測試每功能單位之碳足跡為759.83公斤CO_2e/批,其中,外購電力之溫室氣體排放量為758.23公斤CO_2e/批,占總排放量之99.79%,因此外購電力是晶圓測試碳足跡最主要溫室氣體排放來源。 |
英文摘要 | This study proposes a research structure. The standards of ISO/TS 14067 and carbon footprint (CFP) guide of Environmental Protection Administration are used to investigate the required principles and methods to assess CFP of wafer probing. Based on the relevant standards, the CFP of wafer probing is gained. A real wafer probing factory is used as a case study and the wafer type with the majority of probing demand is chosen to assess the CFP of wafer probing. The functional unit is 25 wafers per lot. Based on the results of the case study, the CFP of wafer probing is 759.83Kg CO_2e per lot. Among them, the greenhouse gases (GHG) emission of purchased electricity is 758.23Kg CO_2e, i.e., 99.79% of total GHG emission. Therefore, purchased electricity is the major GHG emitter of the CFP of wafer probing. |
本系統中英文摘要資訊取自各篇刊載內容。