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題 名 | Parametric Design of the Adhesive Dispensing Process with Multiple Quality Characteristics=點膠製程之多重品質參數設計 |
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作 者 | 黃乾怡; 柏家洛; 洪滋霞; 陳清祥; | 書刊名 | 品質學報 |
卷 期 | 21:4 2014.08[民103.08] |
頁 次 | 頁233-245 |
分類號 | 472.14 |
關鍵詞 | 參數設計; 表面黏著技術; 點膠製程; Parametric design; Surface mount technology; Adhesive dispensing; |
語 文 | 英文(English) |
中文摘要 | 為因應電子產品微小化市場需求,導致表面黏著技術取代傳統的引腳插入技術。製程中將點膠膠水塗佈於元件本體底部,經迴焊後固化。固化溫度曲線需同時考量錫球特性而形成良好焊點,以及膠水特性確保元件有效的黏著於印刷電路板 (Printed Circuit Board, PCB)上,不會於波峰焊製程或人工搬運過程發生元件掉落。本研究運用田口方法設計實驗,應用理想解類似度偏好順序評估法(The Technique for Order of Preference by Similarity to Ideal Solution, TOPSIS)及主成分分析(Principal Component Analysis, PCA)分別決定最適製程參數組合。經由建議製程生產測試樣本,再藉由推力測試評估其有效性。最後,進行確認實驗,結果顯示,信號雜音比皆落在信賴區間95%內,表示點膠接合的強度有明顯的改善。 |
英文摘要 | In response to market demands, the miniaturization of electronic components has lead to the development of Surface Mount Technology (SMT) to replace the traditional Dual Inline process (DIP). Adhesive was deposited on the bottom side of the component body and cured during the reflow soldering. The curing (reflow) profile must simultaneously consider both the solder properties to form a desired solder joint and the adhesive properties to ensure that the component is effectively attached to the Printed Circuit Board (PCB) and does not fall off during the wave soldering process or manual handling of the board. This study uses Taguchi method for experimental design; the Technique for Order of Preference by Similarity to Ideal Solution (TOPSIS) and Principal Component Analysis (PCA) statistical methods to determine the process parameters. Test samples are manufactured by the suggested process and thrust tests are performed to verify its effectiveness. The results from the confirmation tests show that a significant improvement in the adhesive bonding strength is achieved using the suggested process scenario and that the S/N ratio falls into the estimated 95% confidence interval. |
本系統中英文摘要資訊取自各篇刊載內容。