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題名 | 後熱處理對含銅ADI披覆Cu/TiN複合膜耐蝕性之影響=Effect of Post Heat Treatment on Corrosion Resistance of Cu/TiN Duplex Coated ADI Containing Copper |
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作者 | 許正勳; 李鈺萍; 陳荃豪; Hsu, C. H.; Lee, Y. P.; Chen, C. H.; |
期刊 | 鑄造工程學刊 |
出版日期 | 20140600 |
卷期 | 40:2=161 2014.06[民103.06] |
頁次 | 頁26-34 |
分類號 | 472.3 |
語文 | chi |
關鍵詞 | 含銅沃斯回火延性鑄鐵; 電鍍銅; 氮化鈦; 後熱處理; 耐蝕性; Copper alloyed austempered ductile iron; Electroplating copper; TiN; Post heat treatment; Corrosion resistance; |
中文摘要 | 本研究採用含1wt.% Cu之沃斯回火延性鑄鐵(ADI)為基材,先利用電鍍銅(Copper electroplating, CE)作為中介層(~25μm)改善表面球墨孔洞缺陷,再以陰極電弧沉積技術披覆氮化鈦(1.5μm-TiN)薄膜成為複合膜,然後進行300℃不同持溫時間之熱處理,以探討後熱處理對此Cu/TiN-ADI耐蝕性之影響。本實驗利用EPMA、FE-SEM、XRD、TEM及AFM分析鍍膜組成、型態及晶體結構,再利用極化試驗與浸泡試驗進一步了解其耐蝕行為。實驗結果顯示:(1)經複合鍍膜及後熱處理並不會改變ADI基材微結構;(2)電鍍銅有(111)、(200)及(220)之主要繞射平面,與TiN薄膜相同皆為FCC結構,且由EPMA-Line scan可發現後熱處理會造成微量Cu元素擴散至TiN薄膜中,形成摻雜效果(Doping);(3)以3.5wt.%NaCl溶液之耐蝕性測試,ADI披覆Cu/TiN複合膜經300℃-20h後熱處理,由於有適量氧化層(~0.66μm)生成於外層,測試獲得最高的極化阻抗值與最少的浸泡重量損失量,故耐蝕性最佳。 |
英文摘要 | Tests of EPMA, FESEM, XRD, TEM, and AFM were utilized to analyze composition, morphology, and structure of the coating layers. In addition, polarization tests and immersion tests were also performed for understanding corrosion behavior of the coated ADI. Experimental results showed that (1). Microstructure of ADI did not alter after both the coating and post-heating treatments; (2). CE layer showed (111), (200), and (220) crystalline planes, while the TiN film was a FCC structure along with the doping of copper; (3). In corrosion resistance, the Cu/TiN coated ADI after post-heating treatment of 300oC-20h displayed the best corrosion resistance among all coated specimens to have the highest polarization resistance and the lowest weight loss in 3.5wt% NaCl solution. |
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