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頁籤選單縮合
題名 | Variation Pattern Identification and Fault Diagnosis of Solder Paste Deposit by Using Independent Component Analysis=基於獨立成份分析的焊錫膏置放對位之變異樣型辨識與故障診斷之研究 |
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作 者 | 陳偉星; | 書刊名 | 品質學報 |
卷期 | 19:1 2012.02[民101.02] |
頁次 | 頁21-39 |
分類號 | 448.533 |
關鍵詞 | 焊錫膏置放; 故障診斷; 變異樣型辨識; 獨立成份分析; Solder paste printing; Fault diagnosis; Variation pattern identification; Independent component analysis; |
語文 | 英文(English) |
英文摘要 | The objective of this paper is to identify the variation pattern vectors based on a simulated sample of measurement data and then to use the estimates to gain insight into the root cause of the variation patterns in a solder paste printing process. Independent component analysis (ICA) is applied to identify variation pattern and diagnosis faults. From the results of the case study, it indicates that the direction and magnitude of coefficients in the mixing matrix can be restored in a meaningful approach by using the proposed approach. However, the proposed method in this paper for estimating patterns has several limitations, such as a high level of user subjectivity in the ambiguity reduction of mixing matrix. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。