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題 名 | 鐘麻芯材使用蒸氣注入加壓法製造無膠粒片板之發展=Development of Binderless Particleboard from Kenaf Core Using Steam-injection Pressing |
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作 者 | 黃文正; 宋洪丁; | 書刊名 | 林產工業 |
卷 期 | 25:1 民95.03 |
頁 次 | 頁59-73 |
分類號 | 474.5 |
關鍵詞 | 蒸氣注入加壓; 無膠粒片板; 鐘麻芯材; 熱傳導率; 吸音係數; 結合性能; Steam-injection press; Binderless particleboard; Kenaf core; Thermal conductivity; Sound absorption coefficient; Bonding performance; |
語 文 | 中文(Chinese) |
中文摘要 | 鐘麻芯材使用蒸氣注入加壓法之無膠粒片板及低密度無膠粒片板已開發成功。評估蒸氣壓力和處理時間對板密度之影響。設定板密度相對較低,範圍介於0.40~0.70 g/cm^3,而其低密度粒片板設定密度之範圍介於0.10~0.30 g/cm^3之間。性質(即在乾燥和潮溼環境中的破壞模數和彈性模數,內聚強度,吸水率)會因板密度的增加而直線增加。增加蒸氣壓力可以改善抗變強度及內緊強度(IB)。一個長時間的蒸氣處理時間會產生較少的厚度膨脹率,因而使尺寸安定性更佳。適當的蒸氣壓力為1.0 MPa,處理時間為10~15 min。在最佳板密度0.55 g/cm^3條件下之性質破壞模數12.6 MPa,彈性模數2.5 GPa,內聚強度(IB)0.49 MPa,厚度膨脹率7.5%,濕潤破壞模數為2.40 MPa。低密度板材方面,板密度0.20 g/cm^3以及處理時間10 min所產生的數值如下:破壞模數(MOR)1.1 MPa,彈性模數(MOE)0.3 GPa,內聚強度(IB)0.10 MPa,浸水24小時的厚度膨脹率為6.6%,吸水率為355%。低密度無膠粒片板所顯示熱傳導率之數值相似於那些絕緣材料(例如,石棉),並有高吸音係數。在吸音及抗熱之室內產品方面,鐘麻芯材,似乎適合作為低密度無膠板材的原料。使用化學及光譜分析研究鐘麻無膠粒片板之化學變化對於板材結合性能及厚度膨脹率的影響。 |
英文摘要 | Binderless paticleboards were successfully developed from kenaf core using steam-injection press. The target board densities were relatively low, ranging from 0.40 to 0.70 g/cm^3. The properties [i.e., moduli of rupture (MOR) and elasticity (MOE) in both dry and wet conditions, internal bonding strength (IB), and water absorption (WA)] of the boards increased linearly with increased boards density. The bending strength and IB were improved with increased steam pressure .A long steam treatment time contributed to low thickness swelling (TS) values and thus better dimensional stability. The appropriate steam pressure was 1.0 MPa, and the treatment time was 10~15 min. The properties for 0.55 g/cm^3 density boards under optimum conditions were MOR 12.6 MPa, MOE 2.5 GP, IB 0.49 MPa, TS 7.5%, and wet MOR 2.4 MPa. The low-density board of 0.20 g/cm^3 with a 10-min treatment time produced the following values: modulus of rupture 1.1 MPa, modulus of elasticity 0.3 GPa, internal bond strength 0.10 MPa, thickness swelling in 24h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products. The effects of chemical changes in Kenaf core binderless particleboards on the bonding performance and thickness swelling of boards were investigated by chemical and spectroscopic analyses. |
本系統中英文摘要資訊取自各篇刊載內容。