頁籤選單縮合
題 名 | 垂直式探針卡基座應力分析=Stress Analysis of Vertical Probe Card Base |
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作 者 | 邱進東; 陳政湧; 林有鎰; | 書刊名 | 德霖學報 |
卷 期 | 23 2009.06[民98.06] |
頁 次 | 頁93-100 |
分類號 | 448.532 |
關鍵詞 | 垂直式探針卡; 應力; 變形; 有限元素法; Vertical probe card; Stress; Deformation; Finite element mehtod; |
語 文 | 中文(Chinese) |
中文摘要 | 垂直式探針將探針集中在一小區域,所以常會造成探針卡基座應力集中,或是超過材料的降伏強度。 以往研究學者多著重在探針本身的分析,較少探討探針卡基座本身之行為。本文利用幾何非線性有限元 素模型,分析垂直式探針卡基座之應力與變形,以提高製程精度。探針卡基座模型包含底板、PCB 板及 加強材,三者間採用接觸邊界條件,將加強材一端固定同時以均佈負荷模擬垂直式探針作用力。分析結 果顯示,當負荷逐漸增加時,底板中心先變形再逐漸往外圍變形,會使得外圍探針有較大的應力,較容 易疲勞,在探針總作用力為400kg 時,底板及PCB 板在厚度方向變形會過大,必須增加測試時的衝程 探針才能與電路做有效的接觸。 |
英文摘要 | A vertical-type- probe card concentrates the probe on a small zone. It will induce a stress concentration on probe card base, or it exceeds the yield strength. Researchers focused on the probe in the past and less studied on the behaviors of the probe base. In this study, a based on geometrical nonlinear FE model was taken to analyze the produced stress and strain of the vertical-type- probe card base to improve the precision of the IC fabrication processes. The base model involves in a substrate, a PCB board and a stiffener, among which contact boundary condition is used, the end of the stiffener is fixed. The probe force is produced with a uniform loading on the substrate. Based on the analyses, the result shows that the substrate will initially deforms at the center and outwardly with the increasing of loading force. High stress will be induced on the outer part of probe and easily caused fatigue failure. The substrate and PCB board deform largely in the direction of thickness with total loading of 400kgs. It is, then, necessary to increase testing stroke of probe to have an effective contacting. |
本系統中英文摘要資訊取自各篇刊載內容。