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頁籤選單縮合
題名 | Fundamental Understanding of BGA Packaging Subjected to Vibration Loads=球閘陣列封裝在振動載荷基礎下之疲勞壽命 |
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作者 | 吳美玲; | 書刊名 | 中國機械工程學刊 |
卷期 | 29:6 2008.12[民97.12] |
頁次 | 頁509-518 |
分類號 | 448.57 |
關鍵詞 | 球閘陣列封裝; 振動載荷; 疲勞壽命; BGA封裝; Finite element analysis; Vibration failure; Ball grid array packaging; BGA packaging; |
語文 | 英文(English) |