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題 名 | 時效與應變率對Sn-Ag-Sb-Cu銲點機械性質的影響=Aging and Strain Rate Effects on Mechanical Property of Sn-Ag-Sb-Cu Solder Joint |
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作 者 | 黃文勇; | 書刊名 | 南臺科技大學學報 |
卷 期 | 32 2007.12[民96.12] |
頁 次 | 頁111-118 |
分類號 | 472.14 |
關鍵詞 | Sn-Ag-Sb-Cu 無鉛銲料; IMC層; 微觀組織; 拉伸強度; 銲點; Sn-Ag-Sb-Cu lead-free solder; IMC layer; Microstructure; Solder joint; Tensile strength; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究在探討對Sn-3Ag-1.5Sb無鉛銲料中添加0~1.5wt_%Cu對其銲點於銲接後與高溫熱儲存後的微觀組織及拉伸強度的影響。實驗結果證實Sn-3Ag-1.5Sb-xCu的熔點隨Cu量的添加而降低,與固、液共存區的溫差以1.0wt%Cu的銲料最小。在含Cu量大於1.0wt%時,會有金屬間化合物Cu[8fb8]Sn[904e]在銲料內析出,大小隨Cu量的增加而增大,當添加量達最高的1.5wt%Cu時,銲料在長時間熱儲存後,從銲料/Cu界面的IMC層上表面向銲料成長的Cu[8fb8]Sn[904e]長度超過80μm,而銲料內最長的甚至超過100μm。IMC層則隨著銲料Cu量的增加而增厚。銲點的強度隨著其Cu量的加入及拉伸應變率的增加而增強,但隨著熱儲存時間的增加而降低,當時間增加至200小時後,強度的降低較緩,即耐熱性已較穩定。 |
英文摘要 | This study investigates the influence of 0~1.5wt-% Cu addition on the microstructure and the tensile strength of the as-soldered Sn-3Ag-1.5Sb-xCu solder joints and following thermal storage at 150°C for different times. the experimental results show that the melting point of Sn-3Ag-1.5Sb-xCu solder decreases with Cu addition and the solder with 1.0 wt-%Cu is a narrower mushy range between solidus and liquidus. For Cu additions of 1.0wt-% or higher, an intermetallic compound of Cu6Sn5 particles is dispersed clearly and its size increases with the levels of Cu addition increasing. The coarsened long strip-like Cu6Sn5 with a length of more than 80μm growing from upper interface of IMC layer to solder matrix and its length of more than 80μm in the matrix are observed in the solder with 1.5wt-%Cu addition after thermal storage. And the intermetallic compound layer thickens with Cu addition increasing. Additionally, the tensile strength of each solder joint increases with Cu addition and decreases with increasing the time of thermal storage at 150°C. The strength reduction tends to be relatively moderate after 200 hours of thermal storage. Namely, the heat resisting properties tends to be relatively stable. |
本系統中英文摘要資訊取自各篇刊載內容。