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題 名 | RPR封裝效率分析=RPR Encapsulation Efficiency Analysis |
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作 者 | 林勤偉; 李訓誠; 王井煦; 鄭石源; | 書刊名 | 電信研究 |
卷 期 | 36:6 民95.12 |
頁 次 | 頁655-681 |
分類號 | 448.6 |
關鍵詞 | 電路模擬技術; 封裝效率; RPR; Resilient packet ring; IEEE 802.17; Circuit emulation; Pseudo-wire; IETF pwe3; Encapsulation efficiency; |
語 文 | 中文(Chinese) |
中文摘要 | 隨著過去幾年數據訊務的大量增加,Ethernet已成為區域網路的主流技術。對於已擁有龐大TDM網路的電信業者來說,無不希望能夠繼續應用其既有設備來提供新的數據服務。由於TDM與數據服務天生的特性不同,電信業者必須改良其既有網路使其能夠更有效率地處理數據訊務,彈性封包環(RPR;IEEE 802.17)技術正是為了這個目的而制訂的。然而RPR需要在原始訊務中增加RPR標頭,將降低封裝效率,為了在RPR上傳送封包化的TDM訊務而使用擬線(PW)技術時,尙要增加MPLS標頭,這些皆是採用RPR所需付出的封裝額外負擔(EOH)之代價。本文將介紹各種不同架構的RPR以及PW技術,並一一分析其傳送TDM訊務和數據訊務時的封裝效率,分析結果可顯示出採用RPR技術所需付出的EOH代價。 |
英文摘要 | With the large volume of data traffic growing in past years, Ethernet has been the dominant technology in the LAN. Carriers who already have large TDM networks want to leverage their infrastructure to offer new data services. Because of the native characteristic differences between TDM and data services, carries have to adapt their networks to handle data traffic more efficiently. Resilient Packet Ring (RPR; IEEE 802.17) technology is specified for this purpose. However, RPR adds a header to the traffic’s native payload and reduces the encapsulation efficiency. While using Pseudo-Wire (PW) technology for packetized TDM traffic transmission over RPR, MPLS headers needed. These are the Encapsulation OverHead (EOH) penalty of RPR. This paper introduces the different architectures of RPR equipments and the PW technologies. Then we analyze the RPR encapsulation efficiency for both data and TDM traffic transmission. The results show the EOH penalty of RPR. |
本系統中英文摘要資訊取自各篇刊載內容。