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| 題 名 | Sn-9Zn(0~4)Ag迴銲於化金基板後在水中之電化學遷移行為=Electrochemical Migration of Sn-9Zn(0~4)Ag Reflowed on Cu/Ni/Au Substrate in Pure Water |
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| 作 者 | 林景崎; 洪宜芳; 蘇茂華; 簡宏文; | 書刊名 | 防蝕工程 |
| 卷 期 | 20:4 民95.12 |
| 頁 次 | 頁343-352 |
| 分類號 | 472.14 |
| 關鍵詞 | 錫鋅銀銲料; 電化學遷移; 動態極化分析; XPS分析; EDS分析; Sn-Zn-Ag solder; Pure water; Electrochemical migration; Potentiodynamic polarization; XPS; EDS; |
| 語 文 | 中文(Chinese) |
| 中文摘要 | Sn-9Zn-(0~4)Ag迴銲於Cu/Ni/Au基板上,完全浸泡於去純水中做為陰陽兩極,兩極問施以3V~5V直流偏壓,研究其電化學遷移現象。結果顯示:此銲料系統中銀含量由0增高至4wt%時,其抗電化學遷移能力下降。兩銲球間之電化學遷移後之析出物經X-光光電子光譜儀(X-ray photoelectron spectrometer, XPS)分析結果顯示:其主要成分為ZnO、Zn、SnO、Sn,其中所含的鋅/錫比值會隨遷移時間增加而比而減少;由能量散佈光譜(Energy Dispersive Spectrometer, EDS)分析顯示:在遷移1800秒、3600秒後兩極間樹狀析出物的錫含量亦隨時問增加而增加。電化學動態極化法(potentiodynamic polarization)在Sn、Zn、Ag等單一金屬、AgZn₃介金屬及Sn-9Zn-(0~4)Ag三元銲料系統的探討有助於電化學遷移機理之解析。 |
| 英文摘要 | The resistance of electrochemical migration of Sn-9Zn-(0~4)Ag solders, having been reflowed on Cu/Ni/Au, in water at 3~5V DC was found to decrease with increasing their silver content from 0 to 4 wt%. Analysis of XPS and EDX on the dendritc precipitate formed between two electrodes displays that the main components of the precipitate are ZnO, Zn, SnO, Sn. The ratio of Zn/Sn in the precipitate increases with the elapse of migration time. EDS analysis shows that the concentration of tin in the dendrite increases with increasing migration time from 1 800s to 3600s. Exploration in anodic potentiodynamic polarization curves for Sn, Zn, Ag, AgZn₃ and Sn-3Ag-XCu(X=0.0~0.9) benefits discussion of the electrochemical migration mechanism for the Sn-9Zn-(0~4)Ag soldering systems. |
本系統中英文摘要資訊取自各篇刊載內容。