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題 名 | Monitoring Adhesive Curing in Laminated Wood during Bond Development Using the Acousto-Ultrasonic Technique=應用AU技術偵測集成材在膠合硬化過程之研究 |
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作 者 | 林翰謙; | 書刊名 | 嘉大農林學報 |
卷 期 | 3:2 民95.07 |
頁 次 | 頁1-11 |
分類號 | 474.12 |
關鍵詞 | 超音波; 膠合硬化; 集成材; 膠合硬化過程; 超音波穿透速度(ν); 最大振幅; Acousto-ultrasonic; AU; Adhesive curing; Laminated wood; Bond development; Ultrasonic velocity (ν); Maximum amplitude; MA; |
語 文 | 英文(English) |