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頁籤選單縮合
題 名 | 低污染性無電鍍銅可行性之研究=Low Pollution Electroless Copper Deposition Process |
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作 者 | 李九龍; 鄭吉良; | 書刊名 | 龍華科技大學學報 |
卷 期 | 17 民93.07 |
頁 次 | 頁1-5 |
分類號 | 472.16 |
關鍵詞 | 無電鍍銅; |
語 文 | 中文(Chinese) |
中文摘要 | 一般在無電鍍銅製程中,均使用甲醛作為還原劑,其析鍍速率及鍍層結構亦均有不錯的效果,但是考慮甲醛的致癌性和對環境的衝擊性,多年來亦有學者研究以其他還原劑來取代甲醛。本研究主要探討使用低污染性之乙醛酸作為還原劑,並探討各種添加劑對鍍層與析鍍速率之影響,實驗結果顯示使用乙醛酸為還原劑,其析鍍速率較快。 |
英文摘要 | Formaldehyde is usually used as a reducing agent in electroless copper plating, the plating rate and the morphologies of deposited copper film were gain excellent effect, but formaldehyde presents the problem of body and environmental. Many alternative to the reducing agent have been investigated. However, their application are limited, because bath stability and deposited film propertied are not optimal. This study had used the Glyoxylic acid as an reducing agent, the experimental results appear the plating rates and bath stability were superior to that of the formaldehyde. |
本系統中英文摘要資訊取自各篇刊載內容。