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來源資料
頁籤選單縮合
題 名 | Microbially Induced Corrosion of Printed Circuit and Resistance Boards=電路板和電阻板之微生物腐蝕 |
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作 者 | 楊盛行; 林志勇; 林義宗; | 書刊名 | 微免與感染雜誌 |
卷 期 | 31:1 1998.03[民87.03] |
頁 次 | 頁5-14 |
分類號 | 369.38 |
關鍵詞 | 電路板; 電阻板; 微生物腐蝕; Microbially induced corrosion; Printed circuit and resistance boards; Water activity; Energy dispersive spectrometer; Elemental analysis; |
語 文 | 英文(English) |
中文摘要 | 以MIL-STD-810E方法測試電路板和電阻之微生物腐蝕,發現Chaetomium globosum 在其表面生長最好,Aspergillus niger, A. versiclolor和A. flavus次之,而Penicillium funiculosum和Cladosporium resinae則最差。鍍金和鍍錫電路板及電阻板較易引起微生物 腐蝕;而綠漆、MFP、Epoxy 1和Epoxy 2塗敷時,對微生物腐蝕具抗性。水活性愈高時,微 生物生長及腐蝕愈嚴重,當水活性低於0.577,則微生物生長受阻,其腐蝕作用亦未發生。 由EDS表面元素分析知,在腐蝕過程中表面所鍍之金屬含量減少,而銅、氯和鉛等元素則因 微生物生長代謝而增加。 |
英文摘要 | Microbially induced corrosion of printed circuit and resistance boards was tested by MIL-STD-810E method. The growth of Chaetomium globosum was abundant on the surface of test specimen; Aspergillus niger, A. versicolor and A. flavus were moderate, and Penicillium funiculosum and Cladosporium resinae were light. Gold and tin printed specimens had serious microbial corrosion; whereas Solder Mask, MFP, Epoxy 1 and Epoxy 2 printed specimens had resistance for microbial corrosion. Microbial growth and corrosion increased with the water activity, and both of them were inhibited when water activity was below 0.577. From the energy dispersive spectrometer spectra, printed metals decreased sharply during the corrosion process; while copper, chlorine and lead contents increased due to the accumulation of microbial metabolites. |
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