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題 名 | 應用可拓於IC封裝內金線偏移之分析=Application of Extenics during Analysis of Wire Deformation in IC Packages |
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作 者 | 陳家偉; 張士行; 陳春明; | 書刊名 | 中華技術學院學報 |
卷 期 | 25 2002.09[民91.09] |
頁 次 | 頁90-104 |
分類號 | 448.57 |
關鍵詞 | 可拓; 最佳化; Optimization; Extenics; |
語 文 | 中文(Chinese) |
中文摘要 | 金線偏移問題對以打線方式為第一層次的構裝型態來說,是一項影響其品質優劣的重要因素,此現象在導腳數增多及封裝小型化下的趨勢下更加明顯,因此必須加以控制。 此外,探討影響金線偏移的參數,流體密度、流體黏度、塑料溫度、模具溫度、充填時間、轉化時間、金線長度、金線直徑,並以可拓理論法加以分析,找出最佳優度,並作變異分析,找出影響品質特性的重要的因子,評估其誤差和可靠度。 |
英文摘要 | The Wire deformation Problem for wire-bonding which Packaging type of 1st level is one of the major factor effect it's quality. This phenomenon is more obvious as lead counts increase and Package dimensions decrease that need to be controlled. In addition, parameter and process condition, such as density, viscosity, EMC Temperature, molding temperature, filling time, curing time, wire length, wire diameter, on wire sweep were also investigated Than analyzed by Extenics to find an optimal processing parameter. Finally, using the analysis of variance ot find out the major factors that affects the quality characteristic, and estimate it's inaccuracy and reliability. |
本系統中英文摘要資訊取自各篇刊載內容。