頁籤選單縮合
題 名 | 電子產品之碰撞模擬=Impact Simulation of Electronic Products |
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作 者 | 王心靈; 陳夏宗; 簡維元; 黃鐳迪; | 書刊名 | 中州學報 |
卷 期 | 15 2002.06[民91.06] |
頁 次 | 頁307-317 |
分類號 | 448.5 |
關鍵詞 | 3C薄殼產品; 衝擊落地模擬; Thin-wall 3C product; Impact numerical simulation; |
語 文 | 中文(Chinese) |
中文摘要 | 電子產品朝向輕、薄、短、小是未來3C產業不可避免的趨勢。3C薄殼產品的落地衝擊強度是評估產品功能的重要指標。本研究籍由電腦模擬技術以了解主要影響行動電話 (Motorola CD-938為模型),在落地性質之各項參數。同時並探討建立適當模型在數值模擬的準確性。分析結果與驗證部分將於論文中加以闡述。 |
英文摘要 | Manufacturing of 3C (Computer, Communication and Consumer Electronics) products toward weight- reduction, thin-wall and minified-size is an inescapable trend for the future 3C industries. In the present study, numerical simulations for drop test have been applied to a thin-wall computer-dictionary (mobile phone of CD-938) housing to understand the key factors that affect the part drop test performance. A primary investigation of computational simulation is compared with the physical drop/impact data and validation between the simulations and testing will be presented. |
本系統中英文摘要資訊取自各篇刊載內容。