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題名 | 散熱元件之需求與發展歷程=development and Need of Heat Dissipation Component |
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作者姓名(中文) | 陳進龍; | 書刊名 | 金屬工業 |
卷期 | 36:3 民91.05-06 |
頁次 | 頁24-28 |
分類號 | 471.6 |
關鍵詞 | 散熱元件; 散熱器; |
語文 | 中文(Chinese) |
中文摘要 | 隨著電腦的配備不斷提昇,電子元件的散熱處理成為生產電腦的一大課題。電腦的主要發熱來源,包括中央處理器、晶片組、硬碟機等等,而這些電子裝置的散熱規定一般是本體的接點溫度、表面溫度或是工作時的環境溫度不可超過其限制值。為了有效控制電子裝置在規定的溫度範圍內,散熱方式從過去的加大面積以自然對流方式散熱,演變至今日的配以風扇的強迫對流方式散熱。面對發熱量不斷提升的電子裝置,為能提昇散熱器的效能,應著手開發新的散熱材料,以及從流場觀念及全系統散熱角度來設計散熱器。 |
英文摘要 | Along with constant upgrading of computer peripherals, the electronic cooling plays an important role in the process of manufacturing computer. The main heat sources of a computer come from the CPU, chipsets, HDD and etc. However the thermal specification of these instruments is defined by junction temperature, surface temperature or environmental temperature. To effectively keep these instruments work under their safe specification, the cooling technique changes from natural convection by adding the heat transfer area to forced convection by adding fan. Facing the increase in the heat dissipation of microelectronic device, the new material development and cooler design must involve the concept of flow field analysis and full system cooling. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。