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題名 | 晶圓輸送模組之集束型製程設備的產能分析模組=Throughput Analysis of Cluster Tools Equipment for Wafer-transfer Module |
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作者 | 鍾文仁; 林彰仁; 游欽宏; | 書刊名 | 中原學報 |
卷期 | 29:3 2001.09[民90.09] |
頁次 | 頁241-257 |
分類號 | 448.552 |
關鍵詞 | 集束型製程設備; 晶圓輸送; 時序圖; Cluster tools; Timing diagram & scheduling diagram; Wafer-transfer module; |
語文 | 中文(Chinese) |
中文摘要 | 鑑於全球半導體產業的蓬勃發展,以及我國晶圓廠的大量投資,促使國內開始投入IC製程設備之開發。目前半導體設備產業發展的趨勢在如何減少晶片表面污染、降低產 品的製造及傳輸時間、降低設備擁有成本,以及建立簡便快捷維修能力等因素的考量下,集束型製程設備(ClusterTools '亦稱為整合式單晶圓製程設備)的運用,已經成為半導體前段製程設備主要發展的結構。集束型製程設備也正朝著佔地面積(Footprint)小、多製程模組界面、高產能、低成本,以及機械手臂之高可靠度、高輸送速度的方向進行,所以在製程的分析上也面臨到前所未有的挑戰。 本文之主要目的是利用時序圖(TimingDiagram & Scheduling Diagram) ,結合腔體數目、處理腔之處理時間及機械手臂的型式與輸送速度等主要參數,估算出集束型製程設備之產能值,進而建構出φ200rnm型晶圓輸送模組之集束型製程設備產能分析模最且,探討與分析設備產能在各參數改變下之分布狀況。集束型製程設備產能分析電腦模擬工具之程式建構,是依據本文所推導之產能分析模組,運用BorlandC++ Builder 5.0程式語 言撰寫,藉著將製程參數化,讓使用者由程式界面直接輸入製程的參數後,即可快速地獲得製程的產能值,完成產能分析的工作。 |
英文摘要 | Taiwan industries join to deve10p semiconductor manufacturing equipment because the g10ba1 serniconductor industry expands rapidly and Taiwan IC fabrication industry invests a 10t of capital. The trend ofdevelopment for semiconductor manufacturing equipment is towards reducing pollution of wafer's surface, shortening manufacturing and transportation time, decreasing cost of holding equipment, and owning simp1e and quick service ability. The use of c1ustertools (integrated sing1e-wafer manufacturing equipment) has become main developed configuration of serniconductor front-end manufacturing equipment. Cluster to01sis evolving towards sma11er footprint, more process module interfaces, higher throughput, 10wer cost, and higher reliability and transportation speed of robot. Therefore, the analysis of processes also encounters unprecedented difficulty. The main purpose of this paper is using timing diagram & scheduling diagram and combining with the major factors of c1ustertools, number of chambers, process time of process chamber, and type and ansportation spend of robot, to estimate value of throughput for c1usterto01s. The throughput analysis module of c1ustertools for φ200mm wafer-ansfer module is built to confer and analyze distribution of throughput when each factor of cluster tools varies. The throughput analysis program of computer simulation tool is built according to throughput ana1ysis module that derived from the context of the is paper and coded to use Borland C++ Builder 5.0. Because the process is parameterized, user can obtain the va1ue of throughput and achieve ana1ytic work rapidly after input the factors of processes directly through user's interface of the program. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。