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題 名 | 具有電磁屏蔽之塑膠成型構裝雷射模組=Electromagnetic Shielding of Plastic Packaging in Laser Modules |
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作 者 | 鄭傑元; 鄭木海; | 書刊名 | 真空科技 |
卷 期 | 13:2 2000.07[民89.07] |
頁 次 | 頁47-52 |
分類號 | 448.6 |
關鍵詞 | 塑膠成型構裝雷射模組; 塑膠填充高導電性材料; 電磁干擾; 屏蔽效率; 光電模組; 光電通信; EMI; SE; |
語 文 | 中文(Chinese) |
中文摘要 | 本文研究塑膠填充高導電性材料對電磁干擾(EMI)之屏蔽效率(SE),並應用於廉價微小的雙排線式塑膠封裝雷射模組。屏蔽效率在低頻30MHz量測達40dB,在高頻1GHz量測可達60dB以上。良好的屏蔽效率與光特性使塑膠封裝雷射模組適合應用在廉價的OC-12先通訊系統。 |
英文摘要 | In this paper, low-cost MiniDIP conductor laser modules fabricated by plastic molded technology filled with highly conductive materials are proposed for the evaluation of electromagnetic interference (EMI) shielding effectiveness (SE). SE was measured to be 40dB at the low frequency of 30 MHz and more than 60dB at the high frequency of 1 GHz. These excellent SE and good optical characteristics of plastic laser modules are suitable for use in low-cost OC-12 lightwave transmission systems. |
本系統中英文摘要資訊取自各篇刊載內容。