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頁籤選單縮合
題 名 | 銅薄膜應力量測=Stress Measurement of Copper Thin Films |
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作 者 | 周卓煇; 宋建憲; 陸曉慈; | 書刊名 | 材料科學 |
卷 期 | 30:4 1998.12[民87.12] |
頁 次 | 頁239-244 |
分類號 | 440.23 |
關鍵詞 | 銅薄膜; 應力; 彎柄儀; X光繞射儀; 歐傑電子能譜; Copper thin film; Stress; Bending beam technique; X-ray diffraction; Auger electron spectroscopy; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究利用真空彎柄儀量測濺鍍銅薄膜之應力,並探討銅薄膜厚度對其應力行為 的影響。發現不同厚度的銅膜,在同樣的熱處理過程中,其應力行為差異很大。為探討造成 應力行為差異的原因, 利用 X 光繞射儀觀察不同厚度的銅膜之繞射圖形,以了解不同厚度 之銅膜,其結構與應力行為的關係。 利用歐傑電子能譜 (AES) 分析退火後之銅膜,發現銅 / 矽之交互擴散效應顯著,其介面化合物的形成對愈薄的銅膜之應力行為影響愈明顯。 |
英文摘要 | This study was to investigate the effect of thickness on the stress behavior of sputtered copper(Cu) thin film on silicon(Si) substrate by using the bending beam technique in vacuum. During the same thermal cycling, the Cu thin films with different thicknesses exhibited different stress behaviors. X-ray diffraction patterns were thus taken to reveal the realtionship between the structure and stress behavior of the Cu thin films. Auger electron spectroscopy was employed to analyze the Cu thin film after annealing. Marked interdiffusion was observed between the Cu thin films and Si substrates. The resultant interface compound had a pronounced effect on the stress behavior of the thinner Cu films. |
本系統中英文摘要資訊取自各篇刊載內容。