查詢結果分析
來源資料
頁籤選單縮合
題名 | Improvement of Leadframe Positioning in Molding Process of Integrated Circuit Packaging Using Superelastic Ni-Ti Alloys=利用Ni-Ti形狀記憶合金改善積體電路封裝引線架定位之研究 |
---|---|
作者 | 周振嘉; 李振良; Chou, Chen-chia; Li, Jeng-liang; |
期刊 | 中國機械工程學刊 |
出版日期 | 19990800 |
卷期 | 20:4 1999.08[民88.08] |
頁次 | 頁365-371 |
分類號 | 448.57 |
語文 | eng |
關鍵詞 | Ni-Ti形狀記憶合金; 積體電路封裝引線架定位; Shape memory effect; Superelastic; Integrated circuit packaging; Molding process; Leadframe; |
中文摘要 | 本文主要目的是藉由Ni-Ti形狀記憶合金之超彈特性,改善積體電路封裝製程固 定支架上定位銷定位不良的現象。結合電阻量測、拉力試驗、熱處理、焊接實驗與彎曲試驗 之結果顯示形狀記憶合金的定位銷可承受原來設計的 350% 以上之變形量,極適於取代傳統 的中碳鋼定位銷,改善定位不良的問題,並且提高製程上良率。 |
英文摘要 | Application of superelastic Ni-Ti alloys on the locatingpins of a loading-frame that is used in molding process of integrated circuit packaging for leadframe positioning was studied. It is very easy for the locating pins of the fingers in a regular loading-frame to deform during the process, and consequently the alignment of the leadframe/chip/wir assemblies mis-aligned and the amount of inferior parts increases. In the experiment, superelastic Ni-Ti alloy pins were employed to replace the medium carbon steel ones. Resistivity measurement, tensile test, heat treatment, welding experiment and bending test were carried out to evaluate the design and the improvement. Bending and in-plant testing results show that superelastic Ni-Ti alloys improve the performance of the loadingframe greatly. The Ni-Ti locating pins can stand more than 350% of the tolerance of the displacement without producing unsatisfactory results. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。