頁籤選單縮合
題名 | Design and Application of a Cavitating Waterjet=氣蝕水刀的設計與應用 |
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作者 | 吳煌榮; Wu, Whang-zong; |
期刊 | 中國機械工程學刊 |
出版日期 | 19970200 |
卷期 | 18:1 1997.02[民86.02] |
頁次 | 頁15-22 |
分類號 | 446.893 |
語文 | eng |
關鍵詞 | 氣蝕水刀; Waterjet; Cavitation; Nozzle design; |
中文摘要 | 超高壓水刀結合機械手臂系統,已逐漸廣泛應用於自動化精密機械切削加工。同 時藉著添加磨料,大幅提昇切割能力,並降低熱變形及剝層等不良效應。配合特殊加工環境 需求,具創新性水刀系統正嘗試發展中。面對印刷電路板製造業對高切削品質及低污染粉塵 環境的要求,氣蝕水刀深具開發價值。本研究針對水泡侵蝕機理深入分析,歸納出氣蝕水刀 的設計原則。提昇氣蝕效果的設計參數是本文討論的重點。根據實驗結果顯示,本設計之氣 蝕水刀的切割能力的確比一般傳統水刀優越。應用此種水刀,切割印刷電路板,初期效果良 好,肯定繼續發展此符合環保之初割技術的重要性。 |
英文摘要 | Increasing environmental restrictions on the printed circuit board cutting and cleaning have created an interest in the application of an ultra-high pressure cavitating waterjet. The erosion performance of a cavitating waterjet is achieved through a combined effect of the collapse of cavitation bubbles and the impact of high speed water droplets. In the investigation, the damage mechanism of cavitation formation and erosion is analyzed and design principles of a cavitating nozzle are accordingly proposed. Parameters for the optimal performance are discussed. The cavitating nozzle demonstrates four times erosion rate of a conventional nozzle experimentally. Application to the manufacturing processes of PCB boards is promising. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。