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題名 | 酚液化麻竹應用於Resol型水溶性PF樹脂製備及其性質=Properties of Resol-Type Phenol-Formaldehyde Resin Prepared Form Dendrocalamus Latiflorus |
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作者 | 李文昭; 陳奕君; Lee, Wen-jau; Chen, Yi-chun; |
期刊 | 中華林學季刊 |
出版日期 | 20150900 |
卷期 | 48:3 2015.09[民104.09] |
頁次 | 頁321-330 |
分類號 | 467.4 |
語文 | chi |
關鍵詞 | 液化竹材; 麻竹; 酚醛樹脂; 熱示差掃描卡量; Liquefied bamboo; Phenol-formaldehyde resins; Dendrocalamus latiflorus Munro; Differential scanning calorimetry; |
中文摘要 | 本研究將麻竹粉(Dendrocalamus latiflorus Munro; ma bamboo)以酚為溶劑,以鹽酸(HCl)及硫酸(H_2SO_4)為催化劑進行液化處理,液化麻竹(Liquefied ma bamboo; LB)分別以C-LB(鹽酸)及S-LB(硫酸)為代號,福馬林於甲醛/酚莫耳比1.8/1.0及2.0/1.0條件下製備Resol型水溶性高溫硬化型酚醛樹脂(Phenol-formaldehyde resins; PF),並探討其合成樹脂之一般性質、熱硬化性及膠合強度。由試驗結果得知,以H_2SO_4為催化劑之液化麻竹殘渣率較低,粘度較高,分子量較大。以S-LB為酚原料之PF樹脂在反應過程粘度增加快速,其合成樹脂有較大粘度,較短膠化時間。DSC熱分析顯示以C-LB為酚原料之PF樹脂之硬化反應較緩和,以S-LB為酚原料者在較低溫即發生激烈之硬化反應,然硬化反應之放熱量較小。合板膠合強度顯示以C-LB為酚原料之PF具備CNS 1349標準所規範之膠合強度,以S-LB為酚原料者則缺乏耐水膠合強度。 |
英文摘要 | In this study, liquefied ma bamboo (Dendrocalamus latifl orus Munro) C-LB and S-LB were prepared form liquefied Ma bamboo powder in phenol with H2SO4 and HCl as catalysts, respectively. Liquefied ma bamboo C-LB and S-LB was used as raw materials to prepare phenolformaldehyde (PF) resins with the molar ratio of formaldehyde to phenol at 1.8 and 2.0. The characterization, curing behavior and adhesion properties of PF resins were investigated. The results showed that S-LB had less un-liquefied residue, higher viscosity and higher molecules weight than C-LB. PF resins from S-LB were quickly increasing viscosity during synthesis. PF resins from S-LB had higher viscosity and shorter curing time than C-LB. Differential scanning calorimetry analysis showed that PF resins from S-LB had higher curing reactivity than C-LB. The results also indicated that PF resins from S-LB had curing reactivity at low temperature and lower exothermic heat than C-LB. The bonding strength of plywood prepared with resins from C-LB fulfilled the requirement of the CNS 1349 standard. On the other hand, plywood prepared with PF resins from S-LB lacked the water-resistant bonding strength. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。