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題名 | The 'IMC Rings' Growth Mechanism in Sn-Ag-Cu Solder Ball and NiAu-Plated BGA Ball Pad= |
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作者 | Chen, Chun-hsiung; |
期刊 | Journal of The Chinese Institute of Engineers |
出版日期 | 20130600 |
卷期 | 36:4 2013.06[民102.06] |
頁次 | 頁542-549 |
分類號 | 472.14 |
語文 | eng |
關鍵詞 | IMC rings; Sn-Ag-Cu; NiAu ball pad; |
英文摘要 | Due to the environmental pollution concerns, the lead (Pb) element inside the electronics devices must be eliminated by laws in the industries. Lots of the lead-free materials have been introduced and been used for the electronic products and the Sn-Ag-Cu (SAC) is one of most popular lead-free representatives and has been used in high volume production. The most popular IC packages, BGA packages which has higher I/O counts, better thermal and electrical performance than the lead-frame type packages, use the solder ball of Sn-Ag-Cu (SAC) for lead-free applications to connect with Printed Circuit board. A particular phenomenon so-called “IMC rings” is only observed on BGA solder ball pad surface after the Sn-Ag-Cu (SAC) solder balls are mounted on the BGA ball pad which plated NiAu, but has not been found in either eutectic solder or Sn-Ag solder welding on plated NiAu pad. No significant evidence to show that the “IMC rings” degrades the strength of solder joint or cause earlier failures in mechanical test. After all, the “IMC rings” is an inevitable outcome after the Sn-Ag-Cu (SAC) soldered on the plated Ni-Au ball pad. This study is to find the growth mechanism of “IMC rings” on the ball pad which is created between SAC ball and plated-NiAu pad during solder ball temperature reflow. The design of experiment and data has been discussed. |
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