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題 名 | 玻璃雷射熱裂切割技術=Laser Application for Glass Thermal Fracture Cutting Technology |
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作 者 | 吳文弘; | 書刊名 | 科儀新知 |
卷 期 | 29:6=164 2008.06[民97.06] |
頁 次 | 頁33-43 |
專 輯 | 雷射加工應用專題 |
分類號 | 446.893 |
關鍵詞 | 玻璃; 雷射熱裂切割法; |
語 文 | 中文(Chinese) |
中文摘要 | 隨著面板產業的蓬勃發展,快速切割液晶玻璃基板需求激增,雷射熱裂切割法已逐漸取代傳統鑽石刀切割研磨法,成為光電產業液晶玻璃基板的加工主流。但除了液晶玻璃基板的快速切割之外,雷射熱裂切割法在厚板玻璃的切割加工上亦有取代現有加工方法之優勢。本文由熱裂切割理論談起,進而探討雷射於玻璃熱裂切割上之應用,並簡述儀科中心於雷射熱裂切割領域之發展歷程。 |
英文摘要 | The laser thermal fracture cutting technology for brittle materials has become the main technology for LCD glass substrate cutting. This laser thermal fracture cutting technology can be applied to the thick plate glass cutting manufacture process for furniture industry as well. The thermal fracture cutting theory and applications of laser in thermal fracture cutting have been told in this article. And brief introductions of the development of laser thermal fracture cutting technology in ITRC were shown in this article. |
本系統中英文摘要資訊取自各篇刊載內容。