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題名 | Comparison between Vibration and Non-Vibration Wire-Saw under Different Slurry Concentrations and Different Wire Speeds |
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作者姓名(中文) | |
作者姓名(外文) | Hsu, C. Y.; |
書刊名 | 龍華學報 |
卷期 | 16 民89.12 |
頁次 | 頁193-207 |
分類號 | 446.893 |
語文 | eng |
關鍵詞 | Wire-saw; Material removal rate; Machined surface; Roughness of wafer; Slurry concentration; |
英文摘要 | Slurry concentration and wire speed play very important roles n wire saw. In this paper, the effects of different slurry concentrations and different wire speeds on material removal rate、machined surface roughness of the wafer、kerf width and wire wear are investigated. Besides, wire-saw with vibration is compared with that non-vibration. The findings indicate that the presence of vibration results in a higher machining efficiency than non-vibration. In addition, wire-saw with vibration can achieve the peak material removal rate at a lower slurry concentration. On the other hand, wire-saw with vibration does not produce any significant difference in machined surface roughness of the wafer、kerf width and wire wear under different slurry concentrations and wire speeds. |
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