頁籤選單縮合
題名 | Injection Molding Simulation of 3D Stacked-Chip Assembly Packaging with Different Entrances= |
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作者 | Lin, C. M.; Lin, T. C.; Chu, H. M.; Chen, Y. L.; |
期刊 | Journal of Mechanics |
出版日期 | 20070300 |
卷期 | 23:1 2007.03[民96.03] |
頁次 | 頁31-39 |
分類號 | 448.5 |
語文 | eng |
關鍵詞 | 3D stacked-chip packaging; Injection molding; Encapsulation; Air-trap; Weld-line; Thermosetting; Curing; |