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題 名 | 具銅散熱光杯之高電壓陣列高效率發光二極體模組=High Voltage and High-efficiency LEDs with Cup-shaped Coppers Substrate |
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作 者 | 洪瑞華; 唐力紳; 胡鴻烈; 許振鵬; | 書刊名 | 光學工程 |
卷 期 | 122 2013.07[民102.07] |
頁 次 | 頁1-6 |
分類號 | 448.552 |
關鍵詞 | 發光二極體; 銅散熱光杯; Light-emitting diodes; Cup-shaped copper sheets; |
語 文 | 中文(Chinese) |
中文摘要 | 本研究利用電鍍技術製作具高散熱銅光杯結構於高電壓高效率發光二極體陣列模組 (3×3、4×4及5×5)。研究結果顯示,在高電流注入下,具高散熱銅光杯結構之發光二極體陣列模組相較於未具銅光杯結構之之發光二極體陣列模組(3×3、4×4及5×5)的光輸出功率最高分別可提升13%、12%及11%,而熱阻可降低0.7,0.6,0.7 K/ W。由於散熱銅光杯結構可以將LEDs所產生的熱直接由晶粒端傳導至銅基座,並快速傳遞至鋁散熱基板,可以達到快速散熱的效果,進而提升其取光效率。 |
英文摘要 | In this study, cup-shaped copper sheets were developed to improve heat dispassion for high-power light emitting diodes (LEDs) array module (3 × 3, 4 × 4, and 5 × 5) using an electroplating technique. For high-efficiency LEDs with cup-shaped copper sheets, the lateral emitting light extraction and heat dissipation of high-efficiency LEDs were enhanced and efficient. In addition, the light output power was increased of 13, 12, and 11% with 3 × 3, 4 × 4, and 5 × 5 LEDs array module using cup-shaped copper sheet at high current injection. The high thermal transmitting performance of cup-shaped copper heat spreader allows thermal resistance reducing 0.7, 0.6, and 0.7 K/W of 3 × 3, 4 × 4, and 5 × 5 LED array module, respectively. High heat dissipation performance and light extraction were obtained by cup-shaped copper sheet with copper bulk and silver mirror. |
本系統中英文摘要資訊取自各篇刊載內容。