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題 名 | 低熔點活性填料與陶瓷之界面反應熱分析=Thermal Analysis of Interfacial Reactions between Low Melting Point Active Fillers and Ceramics |
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作 者 | 翟雲翔; 蔡騰群; 莊東漢; | 書刊名 | 材料科學 |
卷 期 | 29:1 1997.03[民86.03] |
頁 次 | 頁1-12 |
分類號 | 440.33 |
關鍵詞 | SnAgTi填料; PbInTi填料; 熱差分析; 接觸角量測試驗; 臨界潤濕溫度; 黏著起始溫度; SnAgTi filler; PbInTi filler; DTA; Contact angle experiments; Critical wetting temperature; Threshold adhesive temperature; |
語 文 | 中文(Chinese) |
中文摘要 | SnAgTi與PbInti兩種活性填料之熔點雖僅221℃至325℃之間,但其建議硬焊接合 溫度高達 850 ℃至 950 ℃,本研究嘗試以 DTA 分析此兩種填料與 Al O �陛BZrO �砥BSiC 、 Si �� N �瓷BAlN 及 MgO 陶瓷粉末之界面反應溫度, 其結果與接觸角量測所得 SnAgTi 填料在 Al �荃� O �陛B SiC、ZrO �砟� AIN 陶瓷基板之臨界潤濕溫度及 PbInTi 在這些陶 瓷表面的黏著起始溫度相互比較,發現均相當吻合,其中 PbInTi 之黏著起始溫度可約略視 為其臨界潤濕溫度,由此證實:此種低熔點活性填料在遠高於其熔點以上所存在之臨界潤濕 溫度或臨界黏著溫度是由填料中所添加之活性元素 Ti 與陶瓷之間的界面反應所決定,而此 種活性填料對陶瓷之潤濕性與接合性改善主要是由其所添加之活性元素所造成。 |
英文摘要 | Although the melting temperatures of SnAgTi and PbInTi active fillers are ranged between 221 ℃ and 325 ℃, the brazing temperatures suggested are as high as 850 ℃ to 950 ℃. The interfacial reaction temperatures of these two active fillers with Al �� O ��, ZrO ��,SiC,Si �� N ��, AlN and MgO ceramic powders were evaluated by DTA. Comparing the data with the critical wetting temperatures and the threshold adhesive temperatures for SnAgTi and PbInTi, respectively measured by the contact angle experiments on the Al �� O ��,SiC,ZrO �� and AlN ceramic substrates showed a consistent result. The threshold adhesive temperatures for PbInTi can thus be considered as its critical wetting temperatures. The results indicated that critical wetting temperatures or threshold adhesive temperatures existed far above the melting temperatures were determined by the interfacial reactions between ceramics and the added active element in filler metals. And it was also verified that the improvement of wettability and bondability for the active fillers was resulted from the added active element. �� |
本系統中英文摘要資訊取自各篇刊載內容。