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題名 | 銅--鎳雙金屬觸媒之程溫還原反應研究=The TPR Study of Copper-nickel Bimetallic Catalysts |
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作者 | 林建宏; 張新福; Lin, Jen-hun; Chang, Hsin-fu; |
期刊 | 觸媒與製程 |
出版日期 | 19990800 |
卷期 | 7:2 1999.08[民88.08] |
頁次 | 頁27-46 |
分類號 | 341.393 |
語文 | chi |
關鍵詞 | 銅鎳雙金屬觸媒; 程溫還原; |
中文摘要 | 本研究藉由程溫還原技術(TPR),探討銅鎳雙金屬觸媒的化學環境。改變鍛燒溫度、 擔體的種類、含浸的方法(共含浸及分開含浸),都余影響銅金屬氧化物及鎳金屬氧化物的還 原行為。實驗結果發現以三氧化二鋁為擔體的銅鎳雙金屬觸媒,其銅與鎳皆會與擔體作用而 形成金屬化合物,以二氧化矽為擔體之銅鎳雙金屬觸媒,卻似乎沒有此種現象但其與金屬間 仍有強作用力的存在。隨著鍛燒溫度的上升,金屬與擔體間的作用力及金屬化合物都會增加。 隨著銅含量的增加對氧化鎳產生包覆作用,使得氧化鎳的還原波峰面積變小。我們也發現 spinel的產生是在一開始含浸時就已產生,而不是因鍛燒而造成,且利用分開含浸法所製備 的金屬氧化物較利用共含浸法容易還原。另外還原氣體流速增加會使得波峰的溫度往低溫方 向移動。 |
英文摘要 | Chemical environments of copper-nicket bimetallic catalysts has been studied using the temperature programmed reduction (TPR) technique. The reduction behavior of copper oxide and nickel oxide was affected by the variation of calcinations temperature, supports, and methods of impregnations (co-impregnation and sequential impregnation). The experimental results show that some metal oxides appeared due to the interaction of copper and nickel with alumina support, which for silica supported copper-nickel bimetallic catalysts only a strong interaction between support and metals existed and the interaction increased with increasing temperatures. Encapsule of nickel oxide by the increasing amount of copper oxide induced the attenuation of reduction peak area of nickel oxide. We also found that the evolution of spinel which occurred at the beginning of impregnation was not the consequence of calcinations. The metal oxides prepared by sequential impregnation was easier reduced than those prepared by coimpregnation. Beside, the peak temperature shifted to a lower temperature when the gas flow rate was increased. |
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