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題 名:
Nickel-Nanoparticles-Assisted Direct Copper-Electroplating on Polythiophene Conductive Polymers for PCB Dielectric Holes:
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作 者:
Li, Jiujuan;
Zhou, Guoyun;
Wang, Jinzhong;
Hong, Yan;
He, Wei;
Wang, Shouxu;
Wang, Chong;
Chen, Yuanming;
Yang, Wenjun;
Ma, Chaoying;
Miao, Hua;
Zhou, Jinqun;
Chen, Qingguo;
- 書刊名:
Journal of the Taiwan Institute of Chemical Engineers
- 卷 期:
100 2019.07[民108.07]
- 頁 次:
頁262-268
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被引用次數:期刊(0) 博士論文(0) 專書(0) 專書論文(0)
排除自我引用:0
共同引用:0
點閱:0
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題 名:
Polymer-based Cu/Ag Composite as Seed Layer on Insulating Substrate for Copper Addition of Multi-dimensional Conductive Patterns:
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作 者:
Li, Jiujuan;
Hong, Yan;
Zhou, Guoyun;
Zhang, Huaiwu;
He, Wei;
Wang, Shouxu;
Chen, Yuanming;
Wang, Chong;
Su, Xinhong;
Sun, Yukai;
Andersson, Martin;
- 書刊名:
Journal of the Taiwan Institute of Chemical Engineers
- 卷 期:
123 2021.06[民110.06]
- 頁 次:
頁254-260
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被引用次數:期刊(0) 博士論文(0) 專書(0) 專書論文(0)
排除自我引用:0
共同引用:0
點閱:0